SmartSystems Integration

The functionalities of more and more objects are augmented by digital components hidden inside, as seen in smartphones, smart watches, wearables or smart cars. These digital changes are opening up new opportunities for companies, which can gain competitive advantages if they develop and integrate such components, technologies or systems into their products. Currently many projects are on the way to develop e.g smart multi modal sensors for health applications, emission monitoring, monitoring of industrial processes as well as processes in food and agricultural production.
Thereby smart systems play an important role. They do not only include sensors, actuators as well as electronic components, they are equipped more and more with the functionality to communicate and to work in consorts, to make decisions based on the available data in a predictive or adaptive manner.
The Smart Systems Integration Conference and Exhibition serves as a communication platform for academia, research and industry and enables the exchange of know-how in the field of smart systems integration. The conference addresses again application fields of smart systems as well as smart systems themselves, starting from the design via new building blocks for sensing, data processing, actuating, networking, and smart powering up to heterogeneous integration of the different building blocks, embedded software and manufacturing of the systems.
As in previous years, EPoSS - the European Technology Platform on Smart Systems Integration - is organizing two special sessions on the first day of the conference. Participation in these meetings is open to all interested delegates.
New technologies as well as different aspects of smart systems and their application are addressed in both keynote sessions. On the second day of the conference the keynote session will be completed by a panel discussion. Invited keynote speakers and high level attendees discuss future aspects of smart integrated systems.
For the first time different European projects will present their success stories in two special sessions. Moreover the status of different pilot production lines will be shown.
The prefield trip to Hewlett-Packard 3-D and 4-D printing R&D International Centre on Tuesday, April 9th 2019, completes the program. Directly after this prefield trip EpoSS working group meetings, free of charge, will take place.
The 13th Smart Systems Integration Conference SSI2019 will show a snapshot of the international work in the field of smart systems integration on an application and a basic research level. I'm looking forward to meeting you in Barcelona.