Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.
The 16 papers are grouped as follows:
Chapter 1: Development and Prototyping,
Chapter 2: Printing Technologies,
Chapter 3: Materials and Manufacturing,
Chapter 4: Manufacturing Processes,
Chapter 5: Assembly Technologies and Inspection,
Chapter 6: Quality and Reliability.
Reihe
Sprache
Verlagsort
Zielgruppe
Maße
Höhe: 142 mm
Breite: 125 mm
Dicke: 10 mm
Gewicht
ISBN-13
978-3-03795-948-0 (9783037959480)
DOI
10.4028/www.scientific.net/AMR.1038
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Klassifikation
Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated DevicesNovel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design ToolsOptimized Process Sequences for Prototyping of Molded Interconnect DevicesIntegration of Functional Circuits into FDM PartsPrinting of Functional Structures on Molded 3D DevicesElectrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet PrintingProduction of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet PrintingProgress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact PrintingCharacterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHzNovel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding StereolithographyMID Fabricated by Ultrasonic ProcessingUsage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern GenerationStudy of MID Technologies for Automotive Lighting and Light Signaling DevicesDesign and Solder Process Optimization in MID Technology for High Power ApplicationsHot Pin Pull Method ? New Test Procedure for the Adhesion Measurement for 3D-MID
