Electromagnetic Compatibility (EMC) Design and Test Case Analysis

Name: Electromagnetic Compatibility (EMC) Design and Test Case Analysis
Brand: Wiley-ISTE
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Junqi Zheng(Autor*in)

Wiley-ISTE (Verlag)

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Erschienen am 11. Februar 2019

496 Seiten

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978-1-118-95685-4 (ISBN)

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Inhalt

Intro
Title Page
Copyright Page
Contents
Preface
Exordium
Introduction
Chapter 1 The EMC Basic Knowledge and the Essence of the EMC Test
1.1 What Is EMC?
1.2 Conduction, Radiation, and Transient
1.3 Theoretical Basis
1.3.1 Time Domain and Frequency Domain
1.3.2 The Concept of the Unit for Electromagnetic Disturbance, dB
1.3.3 The True Meaning of Decibel
1.3.4 Electric Field, Magnetic Field, and Antennas
1.3.5 Resonance of the RLC Circuit
1.4 Common Mode and Differential Mode in the EMC Domain
1.5 Essence of the EMC Test
1.5.1 Essence of the Radiated Emission Test
1.5.2 Essence of the Conducted Emission Test
1.5.3 Essence of the ESD Immunity Test
1.5.4 Essence of the Radiated Immunity Test
1.5.5 Essence of the Common-Mode Conducted Immunity Test
1.5.6 Essence of the Differential-Mode Conducted Immunity Test
1.5.7 Differential-Mode and Common-Mode Hybrid Conducted Immunity Test
Chapter 2 Architecture, Shielding, and Grounding Versus EMC of the Product
2.1 Introduction
2.1.1 Architecture Versus EMC of the Product
2.1.2 Shielding Versus EMC of the Product
2.1.3 Grounding Versus EMC of the Product
2.2 Analyses of Related Cases
2.2.1 Case 1: The Conducted Disturbance and the Grounding
2.2.2 Case 2: The Ground Loop During the Conducted Emission Test
2.2.3 Case 3: Where the Radiated Emission Outside the Shield Comes From
2.2.4 Case 4: The "Floating" Metal and the Radiation
2.2.5 Case 5: Radiated Emission Caused by the Bolt Extended Outside the Shield
2.2.6 Case 6: The Compression Amount of the Shield and Its Shielding Effectiveness
2.2.7 Case 7: The EMI Suppression Effectiveness of the Shielding Layer Between the Transformer's Primary Winding and Secondary Winding in the Switching-Mode Power Supply
2.2.8 Case 8: Bad Contact of the Metallic Casing and System Reset
2.2.9 Case 9: ESD Discharge and the Screw
2.2.10 Case 10: Heatsink Also Affects the ESD Immunity
2.2.11 Case 11: How Grounding Benefits EMC Performance
2.2.12 Case 12: The Heatsink Shape Affects Conducted Emissions from the Power Ports
2.2.13 Case 13: The Metallic Casing Oppositely Causes the EMI Test Failed
2.2.14 Case 14: Whether Directly Connecting the PCB Reference Ground to the Metallic Casing Will Lead to ESD
2.2.15 Case 15: How to Interconnect the Digital Ground and the Analog Ground in the Digital-Analog Mixed Devices
Chapter 3 EMC Issues with Cables, Connectors, and Interface Circuits
3.1 Introduction
3.1.1 Cable Is the Weakest Link in the System
3.1.2 The Interface Circuit Provides Solutions to the Cable Radiation Problem
3.1.3 Connectors Are the Path Between the Interface Circuit and the Cable
3.1.4 The Interconnection Between the PCBs Is the Weakest Link of the Product EMC
3.2 Analyses of Related Cases
3.2.1 Case 16: The Excessive Radiation Caused by the Cabling
3.2.2 Case 17: Impact from the Pigtail of the Shielded Cable
3.2.3 Case 18: The Radiated Emission from the Grounding Cable
3.2.4 Case 19: Is the Shielded Cable Clearly Better than the Unshielded Cable?
3.2.5 Case 20: Impacts on ESD Immunity of the Plastic Shell Connectors and the Metallic Shell Connector
3.2.6 Case 21: The Selection of the Plastic Shell Connector and the ESD Immunity
3.2.7 Case 22: When the Shield Layer of the Shielded Cable Is Not Grounded
3.2.8 Case 23: The Radiated Emission Problem Brings Out Two EMC Design Problems of a Digital Camera
3.2.9 Case 24: Why PCB Interconnecting Ribbon Is So Important for EMC
3.2.10 Case 25: Excessive Radiated Emission Caused by the Loop
3.2.11 Case 26: Pay Attention to the Interconnection and Wiring Inside the Product
3.2.12 Case 27: Consequences of the Mixed Wiring Between Signal Cable and Power Cable
3.2.13 Case 28: What Should Be Noticed When Installing the Power Filters
Chapter 4 Filtering and Suppression for EMC Performance Improvement
4.1 Introduction
4.1.1 Filtering Components
4.1.2 Surge Protection Components
4.2 Analyses of Related Cases
4.2.1 Case 29: The Radiated Emission Caused by a Hub Exceeds the Standard Limit
4.2.2 Case 30: Installation of the Power Supply Filter and the Conducted Emission
4.2.3 Case 31: Filtering the Output Port May Impact the Conducted Disturbance of the Input Port
4.2.4 Case 32: Properly Using the Common-Mode Inductor to Solve the Problem in the Radiated and Conducted Immunity Test
4.2.5 Case 33: The Design of Differential-Mode Filter for Switching-Mode Power Supply
4.2.6 Case 34: Design of the Common-Mode Filter for Switching-Mode Power Supply
4.2.7 Case 35: Whether More Filtering Components Mean Better Filtering Effectiveness
4.2.8 Case 36: The Events Should Be Noticed When Positioning the Filters
4.2.9 Case 37: How to Solve Excessive Harmonic Currents of Switching-Mode Power Supply
4.2.10 Case 38: Protections from Resistors and TVSs on the Interface Circuit
4.2.11 Case 39: Can the Surge Protection Components Be in Parallel Arbitrarily?
4.2.12 Case 40: Components in Surge Protection Design Must Be Coordinated
4.2.13 Case 41: The Lightning Protection Circuit Design and the Component Selections Must Be Careful
4.2.14 Case 42: Strict Rule for Installing the Lightening Protections
4.2.15 Case 43: How to Choose the Clamping Voltage and the Peak Power of TVS
4.2.16 Case 44: Choose the Diode for Clamping or the TVS for Protection
4.2.17 Case 45: Ferrite Ring Core and EFT/B Immunity
4.2.18 Case 46: How Ferrite Bead Reduces the Radiated Emission of Switching-Mode Power Supply
Chapter 5 Bypassing and Decoupling
5.1 Introduction
5.1.1 The Concept of Decoupling, Bypassing, and Energy Storage
5.1.2 Resonance
5.1.3 Impedance
5.1.4 The Selection of Decoupling Capacitor and Bypass Capacitor
5.1.5 Capacitor Paralleling
5.2 Analyses of Related Cases
5.2.1 Case 47: The Decoupling Effectiveness for the Power Supply and the Capacitance of Capacitor
5.2.2 Case 48: Locations of the Ferrite Bead and Decoupling Capacitor Connected to the Chip's Power Supply Pin
5.2.3 Case 49: Producing Interference of the ESD Discharge
5.2.4 Case 50: Using Small Capacitance Can Help Solve a Longstanding Problem
5.2.5 Case 51: How to Deal with the ESD Air Discharge Point for the Product with Metallic Casing
5.2.6 Case 52: ESD and Bypass Capacitor for Sensitive Signals
5.2.7 Case 53: Problems Caused by the Inappropriate Positioning of the Magnetic Bead During Surge Test
5.2.8 Case 54: The Role of the Bypass Capacitor
5.2.9 Case 55: How to Connect the Digital Ground and the Analog Ground at Both Sides of the Opto-Coupler
5.2.10 Case 56: Diode and Energy Storage, the Immunity of Voltage Dip, and Voltage Interruption
Chapter 6 PCB Design and EMC
6.1 Introduction
6.1.1 PCB Is a Microcosm of a Complete Product
6.1.2 Loops Are Everywhere in PCB
6.1.3 Crosstalk Must Be Prevented
6.1.4 There Are Many Antennas in the PCB
6.1.5 The Impedance of the Ground Plane in PCB Directly Influences the Transient Immunity
6.2 Analyses of Related Cases
6.2.1 Case 57: The Role of "Quiet" Ground
6.2.2 Case 58: The Loop Formed by PCB Routing Causes Product Reset During ESD Test
6.2.3 Case 59: Unreasonable PCB Wiring Causes the Interface Damaged by Lightning Surge
6.2.4 Case 60: How to Dispose the Grounds at Both Sides of Common-Mode Inductor
6.2.5 Case 61: Avoid Coupling When the Ground Plane and the Power Plane Are Poured on PCB
6.2.6 Case 62: The Relationship Between the Width of PCB Trace and the Magnitude of the Surge Current
6.2.7 Case 63: How to Avoid the Noise of the Oscillator Being Transmitted to the Cable Port
6.2.8 Case 64: The Radiated Emission Caused by the Noise from the Address Lines
6.2.9 Case 65: The Disturbance Produced by the Loop
6.2.10 Case 66: The Spacing Between PCB Layers and EMI
6.2.11 Case 67: Why the Sensitive Trace Routed at the Edge of the PCB Is Susceptible to the ESD Disturbance
6.2.12 Case 68: EMC Test Can Be Passed by Reducing the Series Resistance on the Signal Line
6.2.13 Case 69: Detailed Analysis Case for the PCB Design of Analog-Digital Mixed Circuit
6.2.14 Case 70: Why the Oscillator Cannot Be Placed on the Edge of the PCB
6.2.15 Case 71: Why the Local Ground Plane Needs to Be Placed Under the Strong Radiator
6.2.16 Case 72: The Routing of the Interface Circuit and the ESD Immunity
Chapter 7 Components, Software, and Frequency Jitter Technique
7.1 Components, Software, and EMC
7.2 Frequency Jitter Technique and EMC
7.3 Analyses of Related Cases
7.3.1 Case 73: Effect on the System EMC Performance from the EMC Characteristics of the Component and Software Versus Cannot Be Ignored
7.3.2 Case 74: Software and ESD Immunity
7.3.3 Case 75: The Conducted Emission Problem Caused by Frequency Jitter Technique
7.3.4 Case 76: The Problems of Circuit and Software Detected by Voltage Dip and Voltage Interruption Tests
Appendix A EMC Terms
Appendix B EMC Tests in Relevant Standard for Residential Product, Industrial, Scientific, and Medical Product, Railway Product, and Others
B.1 Radiated Emission Test
B.1.1 Radiated Emission Test Purpose
B.1.2 Radiated Emission Test Equipment
B.1.3 Radiated Emission Test Methods
B.2 Conducted Emission Testing
B.2.1 The Testing Purposes of Conducted Emission
B.2.2 Commonly Used Conducted Emission Test Equipment
B.2.3 Conducted Emission Test Method
B.3 Electrostatic Discharge Immunity Testing
B.3.1 Purpose of an Electrostatic Discharge Test
B.3.2 Electrostatic Discharge Test Device
B.3.3 Electrostatic Discharge Test Method
B.4 Immunity Test of Radio Frequency Electromagnetic Field
B.4.1 The Objective of Radiation Electromagnetic Field Immunity Test
B.4.2 Test Instrument
B.4.3 Radiation Electromagnetic Field Immunity Test Method
B.5 Electrical Fast Transient/Burst Immunity Test
B.5.1 Purpose Electrical Fast Transient/Burst Test
B.5.2 Equipment for Electrical Fast Transient/Burst Test
B.5.3 Method for Fast Transient/Burst Test
B.6 Surge Immunity Test
B.6.1 Purpose of Surge Immunity Test
B.6.2 Equipment for Surge Simulation
B.6.3 Method for Surge Test
B.7 Conducted Immunity Testing
B.7.1 Purpose of Conducted Immunity Test
B.7.2 Equipment for Conducted Immunity Test
B.7.3 Method for Conducted Immunity Testing
B.8 Voltage Dips, Short Interruptions, and Voltage Variations Immunity Testing
B.8.1 Purpose of Immunity Test of Voltage Dips, Short Interruptions, and Voltage Variations
B.8.2 Equipment for Immunity Test of Voltage Dips, Short Interruptions and Voltage Variations
B.8.3 Method for Immunity Test of Voltage Dips, Short Interruptions, and Voltage Variations
Appendix C EMC Test for Automotive Electronic and Electrical Components
C.1 Automotive Electronics and Electrical Components Radiation Emission Test
C.1.1 Purpose of Automotive Electronics and Electrical ComponentsRadiation Emission Test
C.1.2 Equipment for Automotive Electronics and Electrical Components Radiation Emission Test
C.1.3 Automotive Electronics and Electrical Components Radiation Emission Test Method
C.2 Automotive Electronics and Electrical Components Conducted Disturbance
C.2.1 Purpose of Automotive Electronics and Electrical Components Conducted Disturbance
C.2.2 Equipment for Conducted Disturbance Test of Automotive Electronics and Electrical Components
C.2.3 Automotive Electronics and Electrical Components Conducted Disturbance Test Method
C.3 Automotive Electronics and Electrical Components ESD Immunity Test
C.3.1 Purpose of Automotive Electronics and Electrical Components ESD Immunity Test
C.3.2 Equipment for Automotive Electronics and Electrical Components ESD Immunity Test
C.3.3 Automotive Electronics and Electrical Components ESD Immunity Test Method
C.4 Immunity Test of Radiated, Radio Frequency Electromagnetic Field of Automotive Electronics and Electrical Components
C.4.1 Purpose of Immunity Test of Radio Frequency Electromagnetic Field of Automotive Electronics and Electrical Components
C.4.2 Equipment for Immunity Test of Radio Frequency Electromagnetic Field of Automotive Electronics and Electrical Components
C.4.3 Method for Immunity Test of Radio Frequency Electromagnetic Field of Automotive Electronics and Electrical Components
C.5 P 3a, P3b Transient Pulse Immunity Test in ISO2-7637 Standard
C.5.1 Purpose of P3a, P3b Transient Pulse Immunity Test in ISO2-7637 Standard
C.5.2 Equipment for P3a, P3b Transient Pulse Immunity Test in ISO2-7637 Standard
C.5.3 Test Method for Impulse Immunity of P3a and P3b in the Standard ISO 7637-2 and ISO 7637-3
C.6 P1,P2a, P2b, P5a, P5b Impulse Immunity Test in Standard ISO7637-2
C.6.1 The Purpose of P1, P2a, P2b, P5a, P5b Pulse Immunity Test in the Standard ISO 7637-2
C.6.2 Simulation Equipment of P1, P2a, P2b, P5a, P5b Impulse Immunity Testin Standard ISO 7637-2
C.6.3 Immunity Test Method of P1, P2a, P2b, P5a, P5b in Standard ISO7637-2
C.7 BCI and Direct Injection of Conducted Immunity Test
C.7.1 The Purpose of BCI and Direct Injection of Conducted Immunity Test
C.7.2 The Way of BCI and Direct Injection of Conducted Immunity Test
C.8 The Immunity Test of P4 Transient Pulse in the ISO 76372-2 Standard
C.8.1 The Purpose of the Immunity Test of P4 Transient Pulse in the ISO 76372-2 Standard
C.8.2 The Immunity of P4 Transient Pulse Test Equipment in the Standard ISO 76372-2
C.8.3 The Immunity of P4 Transient Pulse Test Methodin the ISO 76372-2 Standard
Appendix D Military Standards Commonly Used for EMC Test
D.1 Special Requirements of Military Products
D.2 Military Specifications for EMC Test Project
D.3 Military Standard EMC Test Basic Configuration
D.4 EMC Test of Military Products
D.4.1 CE101 (25 Hz-10 kHz Power Line Conduction Emission) Test
D.4.2 CE102 (10 kHz-10 MHz Power Line Conduction Emission) Test
D.4.3 CE107 (Power Line Spike (Time Domain) Conducted Emission
D.4.4 CS101 (the Power Line Conduction Susceptibility) Test
D.4.5 CS106 (Power Line Spike Conducted Susceptibility) Test
D.4.6 CS106 (Shell Conduction Current Susceptibility) Test
D.4.7 CS114 (10 kHz-400 MHz Cable Injection Beam Injection Susceptibility) Test
D.4.8 CS115 (Cable Transmission Beam Injection Pulse Susceptibility) Test
D.4.9 CS116 (10 kHz-100 MHz Damped Sinusoidal Transients Conducted Susceptibility Test on Cable and Power Supply Line)
D.4.10 RE101 (25-100 kHz Magnetic Field Radiation Emission Test)
D.4.11 RE102 10 kHz-18 GHz Electric Field Radiation Emission Test
D.4.12 RS101 25 Hz-100 kHz Magnetic Field Radiation Susceptibility Test
D.4.13 RS103 10 kHz-40 GHz Electric Field Radiation Susceptibility Test
D.4.14 RS105 Radiation Transient Electromagnetic Radiation Susceptibility Test
Appendix E EMC Standards and Certification
E.1 The Origin for EMC Technical Standards
E.2 EMC Standard Structure and Classification
E.2.1 Basic EMC Standards
E.2.2 General EMC Standards
E.2.3 Product EMC Standards
E.2.4 EMC Standards for Special Products
E.3 International EMC Standards Organization
E.3.1 International Electrical Commission (IEC)
E.3.2 International Telecommunication Union (ITU)
E.3.3 European Commission for Electrical and Technical Standards (CENELEC)
E.3.4 European Telecommunication Standards Institute (ETSI)
E.4 EMCStandard System in China
E.5 EMCCertification
E.5.1 CE Authentication
E.5.2 FCC Certification
E.5.3 China Compulsory Product Certification (3C Certification)
Further Reading
Index
EULA

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