Wafers and Substrates

Preface
SmartSiC (TM) Substrates: A Boon to Drain Metallization Process
Surface Structuring of Patterned 4H-SiC Surfaces Using a SiC/Si/SiC Sandwich Approach
HYPREZ Wafering Solutions: A Novel Approach of SiC Wafering Solution
Poly-SiC Characterization and Properties for SmartSiC (TM)
Application of Advanced Characterization Techniques to SmartSiC (TM) Product for Substrate-Level Device Performance Optimization
A Novel Approach for Thin 4H-SiC Foil Realization Using Controlled Spalling from a 4H-SiC Wafer
High-Temperature Reorganization Behavior of Single-Crystalline Porous 4H-SiC Thin Foils
Dicing Process for 4H-SiC Wafers by Plasma Etching Using High-Pressure SF6 Plasma with Metal Masks
Investigations on the Recovery of the Electrical Properties of Smart Cut (TM)-Transferred SiC Thin Film Using SiC-on-Insulator Structures
Demonstration of SiC-on-Insulator Substrate with Smart Cut (TM) Technology for Photonic Applications
A Novel Contactless SiC Wafer Planarization Processing after Mechanical Slicing by Dynamic Thermal Annealing Processes
Proposal of Damage-Free SiC Wafer Dicing Using Water Jet Guided Laser
In-Line Charaterization of HPSI SiC Wafers Using High Resolution Surface Photovoltage Spectroscopy (HR-SPS)
Characterization of Very Thin 3C-SiC Epilayers on Si