This volume chronicles the proceedings of the 9th International Symposium on Particles on Surfaces: Detection, Adhesion and Removal held in Philadelphia, PA, June 2004. The study of particles on surfaces is crucially important in a legion of diverse technological areas, ranging from microelectronics to biomedical to space. This volume contains a to
Sprache
Verlagsort
Verlagsgruppe
Zielgruppe
Für höhere Schule und Studium
This volume and its predecessors containing bountiful information on various ramifications of particles on surfaces provide a unified and comprehensive reference source, for anyone interested or involved (centrally or peripherally) in any aspect of particles on surfaces.
Dateigröße
ISBN-13
978-90-474-1822-1 (9789047418221)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Klassifikation
Preface; Part 1: Particle Detection/ Analysis/Characterization and General Cleaning-Related Topics: Recent developments in imaging and analysis of micro- and nanosize particles and surface features; Photodigital imaging as a means of monitoring particulate contamination on surfaces ; Determination of residual particles on surfaces. An updated method for particle extraction using ultrasonics ; Laser inactivation of surfaces and detection of bacteria; Laser-assisted nanofabrication on surfaces using micro- and nanoparticles ; Clean-then-assemble versus assemble-then-clean: Several comparisons; Development of a non-contact post-CMP cleaning process for copper; Using ozonated DI water for pre-gate cleaning; Decontamination of surrogate Pu-238 legacy wastes; Solar panel obscuration by dust and dust mitigation in the Martian atmosphere ; Part 2: Particle Adhesion and Removal: Adhesion and friction of single micrometer-sized particles; The effect of laser-induced micro-roughness of textile fibers on adhesion and capture of micrometer-sized particles; Advances in wafer cleaning and particle removal technology; Particle removal challenges and solutions in semiconductor fabrication CMP processes; Laser cleaning of model sub-micrometer particulate contaminants from Si surfaces; Removal of particles using the combined effect oflaser-induced shock wave and explosive vaporization of liquid; Particle removal by attenuated total internal reflection of laser light; Removal of sub-1 00-nm particles from structured substrates with C02 snow; Particle removal by dense-phase fluids using ultrasonics; Prediction of particle removal using surfactants; Removal of micrometer-size particles from solid surfaces by an impinging air jet
