This volume documents the proceedings of the Second Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the aegis of the Dielectric Science and Technology Division of the Electrochemical Society in Montreal, Canada, May 7-10, 1990. The first symposium on this topic was held in Chicago, October 10-12, 1988 and the proceedings of l which have been chronicled in a hard-bound volume l As pointed out in the Preface to the proceedings of the first symposium the metallized plastics find scores of applications ranging from very mundane to very sophisticated. Even a cursory look at the literature will convince that this field has sprouted; and there is every reason to believe that with all the research and development activities taking place, new and exciting applications of metallized plastics will emerge. The program for the second symposium was very comprehensive as it included 46 papers covering many aspects of metallized plastics. This symposium was a testimonial to the brisk research activity and keen interest in the topic of metallized plastics. The success of this symposium reinforced our earlier belief that there was a definite need to hold symposia on this topic on a regular basis. Concomitantly, the third symposium in this vein was held in Phoenix, Arizona, October 13-18, 1991 and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. As regards the present volume, it contains a total of 35 papers covering a variety of topics ranging from very fundamental to very applied.
Sprache
Verlagsort
Verlagsgruppe
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Dateigröße
ISBN-13
978-1-4899-0735-6 (9781489907356)
DOI
10.1007/978-1-4899-0735-6
Schweitzer Klassifikation
I. Metallization Techniques and Properties of Metal Deposits.- An Electrochemical Method of Polyimide Metallization.- Electroplating of Polymers, Gas Permeability and Adhesion of the Composite Materials.- Molecular Level Metal and Ceramic/Polymer Composites. Synthesis of Metal and Metal Oxide Containing Polyimides and its Relevance to Polymer Metallization.- Photolithographic Plating of Platinum and Copper on Insulating Substrates.- Metallized Indium Island Films for Flexible Automotive Trim.- Metallization of Plastics by Physical Vapor Deposition Techniques.- Ion Beam Assisted Metallization of Plastics.- Plasma Induced Deposition of Copper Films on Polymer Surfaces.- Metallization of Polytetrafluoroethylene (PTFE) by Means of Plasma-Enhanced Chemical Vapour Deposition.- Metallization of Plastics Via Low Temperature Arc Vapor Deposition (LTAVD).- Magnetron Sputtered Tin Hard Coatings on Plastics.- Diffusion and Gettering Simulations of Ion Implanted Copper in Polyimide.- II. Investigation of Interfacial Interactions.- Comparison Between the Interfacial Chemistry of Metallized Polyimides and Polyimide Films on Bulk Metal Substrates.- Chemical Interactions at Polymer-Metal Interfaces of Interest to Microelectronics.- Photoelectron Spectroscopy Model Study of the Interface Between Polyimide and Copper.- Electronic Structure of Metal/Polymer Interfaces: Aluminum on Conjugated Polymers.- Study of Chemical Interactions in Metallized Polymers Used for Microelectronic Packaging.- XPS Study of the Interface Between Thermally Evaporated Aluminium and Polyethyleneterephthalate: Evidence for Oxycarbide Species.- XPS-Study of Metal-Polymer Interfaces After Polymer Surface Treatment by Ion and Plasma Techniques.- Behavior of Metal-Polyimide Interfaces Under Degradative Ambients.- Study of Titanium/Polyimide Interface in a Reducing Environment.- III. Plastic Surface Modifications.- Ion Beam Induced Chemical Reactions at Polymer Surfaces.- Surface Pre-treatment and Metal Coating of Commercial Polyimide Studied by Surface Analytical Techniques.- Characterization of a Surface Chemically-Modified Polyimide.- Diffusion of Ions in a Surface Chemically-Modified Polyimide.- Modification of Polymer Surfaces by Dual Frequency Plasma.- Electrochemical Reduction of PMDA-ODA and Effects on Metal/Polyimide Interfacial Reliability.- IV. Adhesion Aspects of Metallized Plastics.- Sticky Polymers Through Ion Beam Processing.- Molecular Dynamic Phenomena at Polymer Surfaces and Their Relevance to Polymer Adhesion Behavior.- Enhanced Metal/Polymer Adhesion by Ion Assisted Deposition.- An Improved Process to Facilitate the Chemical Bonding of Electroless Copper to Polyetherimide Surfaces.- Adherent Electroless Copper Layers on Polystyrene.- Correlation Between Surface Chemistry of Polycarbonate and its Adhesion Behavior to Electrolessly Plated Copper.- Water-Induced Degradation of Metal/Polyimide Interfaces.- Thin Film Adhesion Measurement Using Excimer Laser Ablation and Tensile Extension Tests.- About the Contributors.
