This volume chronicles the proceedings of the Symposium on Adhesion Aspects of Polymeric Coatings held under the auspices of the Electrochemical Society in Minneapolis, MN, May 10-15, 1981. This event was cosponsored by the Dielectric and Insulation, and Electrothermics and Metallurgy Divisions. Polymeric coatings are used for a number of purposes, e. g. , decorative, protective, functional (as dielectrics or insulators) and a special application of polymeric (organic) coatings is their use as lithographic materials for making integrated circuit elements. Irrespective of the purpose of the coating, it must adhere well to the underlying substrate. So the need to under stand the factors which influence adhesion of organic coatings and the ways to attain desired adhesion is quite manifest. This Symposium was designed to bring together scientists and technologists interested in the adhesion aspects of polymeric coatings, to provide a forum for discussion of latest findings, and to provide an opportunity for cross-pollination of ideas. The technical program contained a total of 46 papers by authors from various corners of the world. The program comprised both invited overviews and contributed original research papers, as this blend is the best way to present the state of knowledge of a topic. The invited speakers were selected so as to represent widely differ ing disciplines and interests and they hailed from various aca demic and industrial research laboratories.
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Verlagsort
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ISBN-13
978-1-4613-3658-7 (9781461336587)
DOI
10.1007/978-1-4613-3658-7
Schweitzer Klassifikation
I. General Overviews.- Acid Base Interactions Between Oxide Surfaces and Polar Organic Compounds.- Adhesion of Polymers to Metals: The Role of Surface Topography.- Recent Progress in the Studies of Molecular and Microstructure of Interfaces in Composites, Coatings and Adhesive Joints.- Adhesion and Internal Strain in Polymeric Coatings.- Determining the Locus of Failure with Modern Surface Analysis Techniques.- II. Factors Influencing Adhesion.- Processing Conditions and the Adhesion Properties of Styrene/Acrylic Polymers.- Variables Affecting the Adhesion of Aliphatic Amine-cured Epoxy Resin to Metal and Ceramic Adherends.- The Relationship of Sulfuric-Chromic Acid (FPL) Etch Composition to the Surface Properties of 2024 T-3 Aluminum Alloy.- Adhesion of Plasma-Polymerized Films (A Model Study on Water Sensitivity of Adhesion).- Epoxy Adhesion to Copper.- Infrared Spectroscopic Investigation of Polymer Coating-Metal Substrate Interaction.- The Relationship Between Adhesion and Polyelectrolyte Solution Conformation as Studied by Fourier Transform IR Spectroscopy.- Conformation and Dynamics of Adsorbed Polymer Molecules Subjected to Flow.- PTFE Film Adhesion to Electronically Conducting Materials.- III. Bond Durability.- Durability of Metal Polymer Bonds.- Correlation of Surface Chemistry and Durability of Aluminum/Polymer Bonds.- A Case Study of Water Sensitivity of Polymeric Coating-Substrate Interface for Two Aluminum Surface Preparations.- Adhesion of Organic Coatings and its Loss due to Corrosion.- The Effects of Environment on Paint Adhesion to Steel.- Effect of Aging of Pigmented Polymeric Films on Adhesion to Metal Substrates.- IV. Adhesion Promotion Via Coupling Agents.- Silane Adhesion Promoters for Polymeric Coatings.- Structure and Effects of Organosilane or Organo-titanate Adhesion Promoters on Al203/Polyethylene Joints.- Improved Wet Strength Adhesion of Epoxy Coatings to Steel.- The Use of Coupling Agents to Improve the Adhesion of Polymer Matrices for Electronic Applications.- Adhesion Promotion and Polymer Composite Performance with Titanate Coupling Agents.- Synthesis and Testing of ?-Diketone Coupling Agents for Improved Durability of Epoxy Adhesion to Steel.- Interfacial Coupling by Alkoxytitanium and - Zirconium Tricarboxylates.- V. Resist Adhesion.- Adhesion, Wettability and Surface Chemistry.- Organosilanes as Process Compatible Adhesion Promoters for Resist Materials.- Recognition and Discussion of Basic Adhesion Mechanisms in Photopolymeric Systems.- Factors Affecting Dry Film Photoresist Adhesion on Electroless Copper Surfaces.- VI. Adhesion Measurement.- Pull-off Test, an Internationally Standardized Method for Adhesion Testing - Assessment of the Relevance of Test Results.- Quantifying the Tape Adhesion Test.- Indentation-Debonding Test for Adhered Thin Polymer Layers.- Thermographic Detection of Polymer/Metal Adhesion Failures.- Ultrasonic Inspection Potential for Polymeric Coatings.- About the Contributors.
