Metallurgical coatings 1988 is a compilation of the proceedings of the 15th International Conference on Metallurgical Coatings. This volume is divided into four parts, which deal with synthesis and properties of coatings used in microelectronic applications; methods of characterizing coatings and modified surfaces; protective coatings for magnetic and optical thin film media; and thick and thin film censors.
The first part of this volume is further subdivided into five sections focusing on thin film barrier layers, metallization for VLSI circuits, thin films used in packaging technology, new materials and emerging technologies and synthesis and microstructure of high Tc superconductors. The second part is also subdivided into four sections, each presenting different methods, such as the surface and thin film analysis techniques, microstructural characterization techniques, mechanical properties of films and coatings, and non-destructive characterization techniques.
Part three discusses the preparation and characterization of reactively sputtered silicon nitride thin films, the bond structures and properties of chemically vapor-deposited amorphous SiC, and the wear of Co-Ni thin film magnetic recording tape against metallic and ceramic surfaces. Finally, this volume explores the insert-mounted thin film sensors for real-time.
Sprache
Verlagsort
Verlagsgruppe
Elsevier Science & Techn.
Dateigröße
ISBN-13
978-0-08-098485-8 (9780080984858)
Schweitzer Klassifikation
Synthesis and Properties of Coatings Used in Microelectronic Applications Thin film barrier layers Reaction kinetics in tungsten/barrier metal/silicon systems Reactively sputtered indium oxide diffusion barrier Al3Ti formation by diffusion of aluminum through titanium Chemical stability of vanadium boride with aluminum Metallization for VLSI circuits The deposition mechanisms and microstructures of tungsten films produced by silicon reduction of WF6 A comparison of the step coverage of aluminum coatings produced by two sputter magnetron systems and a dual-beam ion system Reactive-ion-etch-compatible metallization for partially covered contact applications Effect of encapsulation on the reaction between palladium and GaAs thin films Thin films used in packaging technology Process technology for packing applications Coatings for strain compliance in plastic packages: opportunities and realities Interface interactions relevant to packaging technology The reliability of integrated circuits protected with Ti-W/Au bumps Focused electron and ion beam repair strategies for wafer-scale interconnections in thin film packaging New materials and emerging technologies Characterization of HfBx films deposited by r.f. diode and r.f. magnetron sputtering Ceramic beams and thin film growth Nitrides of titanium, niobium, tantalum and molybdenum grown as thin films by the atomic layer epitaxy method In0.30Al0.70As /In0.30Ga0.70As quasi-insulating gate strained-layer field effect transistors grown by molecular beam epitaxy Synthesis and microstructure of high Tc superconductors Thermally sprayed coatings of YBa2Cu306 + x Growth and properties of YBa2Cu307 - x superconducting thin films Effects of deposition conditions on the superconducting properties of r.f. and d.c. magnetron sputter-deposited YBa2Cu307 - x filmsMethods of Characterizing Coatings and Modified Surfaces Surface and thin film analysis techniques Analysis of TiN by charged particle beams: nuclear reaction analysis, nuclear reaction broadening and Rutherford backscattering An evaluation of four computer modelling programs for Rutherford backscattering spectrometry analysis of oxidized surfaces Resonant low energy electrons and their impact on non-destructive depth profiling of thin film samples Chemical characterization of the deactivation and protection of FeTi thin films using complementary non-destructive techniques Microstructural characterization techniques Structural changes induced by heating in electroless nickel-phosphorus alloys Plasma spraying o f WO3: structural characterization of the coatings Electrical insulating properties of r.f.
