Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.
The 16 papers are grouped as follows:
Chapter 1: Development and Prototyping,
Chapter 2: Printing Technologies,
Chapter 3: Materials and Manufacturing,
Chapter 4: Manufacturing Processes,
Chapter 5: Assembly Technologies and Inspection,
Chapter 6: Quality and Reliability.
Collection of selected, peer reviewed papers from the 11<sup>th</sup> International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany.
The 16 papers are grouped as follows:
Chapter 1: Development and Prototyping,
Chapter 2: Printing Technologies,
Chapter 3: Materials and Manufacturing,
Chapter 4: Manufacturing Processes,
Chapter 5: Assembly Technologies and Inspection,
Chapter 6: Quality and Reliability.
Reihe
Sprache
Verlagsort
Zielgruppe
Illustrationen
Illustrations, unspecified
Dateigröße
ISBN-13
978-3-03826-636-5 (9783038266365)
DOI
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Klassifikation
<ul><li>Preface and Committees</li><li>Chapter 1: Development and Prototyping</li><li>Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices</li><li>Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools</li><li>Optimized Process Sequences for Prototyping of Molded Interconnect Devices</li><li>Integration of Functional Circuits into FDM Parts</li><li>Chapter 2: Printing Technologies</li><li>Printing of Functional Structures on Molded 3D Devices</li><li>Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing</li><li>Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing</li><li>Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing</li><li>Chapter 3: Materials and Manufacturing</li><li>Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz</li><li>Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray Method</li><li>Experimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography</li><li>MID Fabricated by Ultrasonic Processing</li><li>Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation</li><li>Chapter 4: Manufacturing Processes</li><li>Study of MID Technologies for Automotive Lighting and Light Signaling Devices</li><li>Chapter 5: Assembly Technologies and Inspection</li><li>Design and Solder Process Optimization in MID Technology for High Power Applications</li><li>Chapter 6: Quality and Reliability</li><li>Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID</li></ul>
