Magnetic bubbles are of interest to engineers because their properties can be used for important practical electronic devices and they are of interest to physicists because their properties are manifestations of intriguing physical principles. At the same time, the fabrication of useful configurations challenges the materials scientists and engineers. A technology of magnetic bubbles has developed to the point where commercial products are being marketed. In addition, new discovery and development are driving this technology toward substantially lower costs and presumably broader application. For all of these reasons there is a need to educate newcomers to this field in universities and in industry. The purpose of this book is to provide a text for a one-semester course that can be taught under headings of Solid State Physics, Materials Science, Computer Technology or Integrated Electronics. It is expected that the student of anyone of these disciplines will be interested in each of the chapters of this book to some degree, but may concentrate on some more than others, depending on the discipline. At the end of each chapter there is a brief summary which will serve as a reminder of the contents of the chapter but can also be read ahead of time to determine the depth of your interest in the chapter.
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ISBN-13
978-3-642-96549-4 (9783642965494)
DOI
10.1007/978-3-642-96549-4
Schweitzer Klassifikation
1. Introduction to Magnetic Bubbles.- 1.1 What Are Magnetic Bubbles?.- 1.2 Available Bubble Materials.- 1.3 How Can Bubbles be Manipulated?.- 1.4 Why Are Bubbles of Practical Interest?.- 1.5 A Typical Storage Device.- 1.6 Why Are Bubbles of Scientific Interest?.- 1.7 Scope and Organization of the Book.- 1.8 History.- 1.9 Summary.- 2. Static Properties of Magnetic Bubbles.- 2.1 Fundamental Characteristics of the Bubble Film.- 2.2 Bubble Domain Configurations.- 2.3 Summary.- 3. Dynamic Properties of Magnetic Bubbles.- 3.1 Motion of a Wall.- 3.2 Motion of a Bubble.- 3.3 Summary.- 4. Basic Permalloy-Bar Bubble Devices.- 4.1 Propagation.- 4.2 Other Functional Elements.- 4.3 Total Chip Performance.- 4.4 Device Scaling.- 4.5 Summary.- 5. Other Bubble Device Forms.- 5.1 Two-Level Permalloy Bar.- 5.2 Charged-Wall Bubble Devices.- 5.3 Bubble Lattice Devices.- 5.4 Current Sheet Devices.- 5.5 Summary.- 6. Bubble Materials.- 6.1 The General Approach to Tailoring the Properties of Bubble Materials.- 6.2 Garnets.- 6.3 Hexaferrites.- 6.4 Amorphous Materials.- 6.5 Orthoferrites.- 6.6 Summary.- 7. Device Chip Fabrication.- 7.1 Crystal Growth.- 7.2 Substrate Preparation.- 7.3 Film Growth.- 7.4 Fabrication of Device Structure.- 7.5 Summary.- 8. Chip Packaging.- 8.1 The Storage Unit.- 8.2 The Storage Module.- 8.3 Limitations on Module Size.- 8.4 Data Integrity.- 8.5 Module Testing.- 8.6 Summary.- 9. Applications.- 9.1 Useful Features of Bubble Devices.- 9.2 General Purpose Storage Units.- 9.3 Storage Hierarchies.- 9.4 Special Purpose Applications.- 9.5 Summary.- 10. Future Prospects.- 10.1 Dependencies of the Module Attributes.- 10.2 Constraints on Active Chip Area.- 10.3 Constraints on Device Cell Density.- 10.4 Constraints on Operating Frequency.- 10.5 Loop Length.- 10.6 Areas for FutureResearch.- 10.7 Summary.- References.
