Properties and Applications of Polyimides

Name: Properties and Applications of Polyimides
Brand: Nova Science Publishers Inc
Price: 197.99 EUR
Availability: OnlineOnly

Liu Changwei(Herausgeber*in)

Nova Science Publishers Inc

Erschienen am 15. November 2023

238 Seiten

E-Book

PDF mit Adobe-DRM

Systemvoraussetzungen

979-8-89113-210-8 (ISBN)

197,99 €inkl. 7% MwSt.

Systemvoraussetzungen

für PDF mit Adobe-DRM

E-Book Einzellizenz

Als Download verfügbar

Beschreibung

Weitere Details

Weitere Ausgaben

Inhalt

Intro
Contents
Preface
Acknowledgments
Introduction
Chapter 1
The Functionalization and Applications of Polyimide Aerogels
Abstract
Introduction
1. Aerogels
1.1. Preparation Process of Aerogels
1.1.1. Sol-Gel Process
1.1.2. Commonly Used Drying Methods
1.2. Classification of Aerogels
1.2.1. Inorganic Aerogels
1.2.2. Organic Aerogels
1.2.3. Organic-Inorganic Hybrid Aerogels
2. PI Aerogels
2.1. PI Aerogel Structure and Characteristic Properties
2.2. PI Aerogel Preparation Methods
2.2.1. Preparation of PI Aerogels Based on the Condensation of Acid Anhydride Groups and Amino Groups
2.2.2. PI Aerogels Synthesized by Isocyanate Method
2.2.3. Preparation of PI Aerogels Based on Water-Soluble Polyamic Acid Salts
2.2.4. Preparation of PI Aerogels Based on Other Methods
3. Functionalization of PI Aerogels and Their Applications
3.1. Thermal Insulation Materials
3.1.1. Thermal Insulation Properties of Pure PI Aerogels
3.1.2. Thermal Insulation Performance of Composite PI Aerogels
3.2. Low Dielectric Constant Materials
3.2.1. Overview of Low Dielectric Materials
3.2.2. PI-Based Low Dielectric Constant Materials
3.2.3. The Future Development Direction of Low Dielectric Constant Materials
3.3. Hydrophobic Materials
3.4. Gas Separation, Adsorption, and Filtration Materials
3.5. Anti-Radiation Materials
3.6. Wearable Textile Materials
3.7. Other Aspects
Conclusion
References
Chapter 2
Thermal Conductivity Enhancement of Polyimide and Polyimide Composites
Abstract
Symbols
Abbreviations
Organic Abbreviations
Introduction
1. Design Strategies for Thermally Conductive PI Materials
1.1. General Concepts of Thermal Conduction
1.2. Thermal Conduction Mechanisms of Intrinsic Thermal Conductive PI
1.3. Thermal Conduction Mechanisms of PI-Based Thermal Conductive Composites
2. Recent Progress in Intrinsic Thermal Conductive PI Materials
2.1. Molecular Orientation
2.2. Copolymerized PI Materials
2.3. Liquid Crystalline PI Materials
3. Recent Progress in Thermal Conductive PI Composite Materials
3.1. Shape and Size of Fillers
3.2. Function Fillers
3.3. Aligned Fillers
3.4. Hybrid Fillers
3.5. 3D Thermal Conductive PI Materials
3.6. Processing Technology
3.7. Graphene-Carbon Composite
Conclusion
References
Chapter 3
Temperature-Resistant Polyimide Adhesives
Abstract
Introduction
1. Classification of Polyimide Adhesives
1.1. Polyimide Adhesives Used in Metal Bonding
1.2. Polyimide Adhesives Used in Li-Ion Batteries
1.3. Polyimide Adhesives Used in Wafer Level Packaging (WLP)
2. Properties of Polyimides
2.1. Inter-Molecular and Intra-Molecular Interactions
2.2. Mechanical Properties of Polyimides
2.3. Thermal Resistance of Polyimides
2.4. Dielectric Properties of Polyimides
3. PI Adhesives Applied in Metallic Materials
3.1. PAA Adhesives Used as Metal Adhesives
3.2. Thermoplastic PI Adhesives
3.3. Thermosetting Polyimide Adhesives
4. PI Adhesives Used in Batteries
4.1. Improved Adaptability of Binder to Volume Changes in Electrode
4.2. Enhanced Binder Ion-Conducting Performance
4.3. Batteries with Improved Cycle Stability
5. PI Adhesives Used in Wafer Level Packaging (WLP)
5.1. Hybrid Bonding Process with Copper/Polyimide System
5.2. Polymer-to-Solder (P/S) Thickness Ratios in Polymer/Metal Hybrid Bonding
6. Outlook
Conclusion
References
Conclusion
Index
Blank Page
Blank Page

Systemvoraussetzungen

Als PDF speichern Als Link merken