This is the second volume of Advances in Acoustic Microscopy. It continues the aim of presenting applications and developments of techniques that are related to high-resolution acoustic imaging. We are very grateful to the authors who have devoted considerable time to preparing these chapters, each of which describes a field of growing importance. Laboratories that have high-performance acoustic microscopes are frequently asked to examine samples for which the highest available resolution is not necessary, and the ability to penetrate opaque layers is more significant. Such applications can be thought of as bridging the gap be tween acoustic microscopy at low gigahertz frequencies, and on the one hand nondestructive testing of materials at low megahertz frequencies and on the other hand medical ultrasonic imaging at low megahertz frequencies. Commercial acoustic microscopes are becoming increasingly available and popular for such applications. We are therefore delighted to be able to begin the volume with chapters from each of those two fields. The first chapter, by Gabriele Pfannschmidt, describes uses of acoustic microscopy in the semiconductor industry. It provides a splendid balance to the opening chapter of Volume 1, which came from a national research center, being written from within a major European electronics industry itself. Dr Pfann schmidt describes the use of two quite different types of acoustic microscopes, and points out the advantages of each for specific purposes.
Rezensionen / Stimmen
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An outstanding work.
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The Journal of Scanning Microscopies, January 1998
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Very well written and illustrated...the subjects selected are of major importance and...the editors (and the authors) have perfomed an outstanding work in presenting in the same volume both fundamental studies and medical or industrial applications.
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Scanning, 1998
Reihe
Auflage
Sprache
Verlagsort
Verlagsgruppe
Illustrationen
ISBN-13
978-1-4615-5851-4 (9781461558514)
DOI
10.1007/978-1-4615-5851-4
Schweitzer Klassifikation
1. Characterization of Electronic Components by Acoustic Microscopy.- 1.1. Introduction.- 1.2. Commonly Used Ultrasonic Microscope Equipment.- 1.3. Failure Mechanisms Induced by Assembly-Related Problems.- 1.4. Advantages and Limitations of Acoustic Microscopy in the Semiconductor Industry.- 1.5. Ultrasonic Microscope Applications in the Production, Qualification, and Failure Analysis of Semiconductor Devices.- 1.6. Conclusions.- References.- 2. Principles and Applications of High-Frequency Medical Imaging.- 2.1. Introduction.- 2.2. Historical Perspective of Echographic Concepts.- 2.3. High-Frequency Medical Ultrasonic Systems.- 2.4. Scanning Modes and Scanning Electronics.- 2.5. Ultrasonic High-Frequency Imaging Transducers.- 2.6. Dermatological Applications.- 2.7. Ophthalmological Applications.- 2.8. Intravascular Ultrasound Imaging.- 2.9. Conclusion.- References.- 3. Interaction of Acoustic Waves with Solid Surfaces.- 3.1. Introduction.- 3.2. Acoustic Reflection Coefficient at a Liquid/Solid Interface.- 3.3. Layered Materials and Guided Waves.- 3.4. Method and Apparatus of Measurement.- 3.5. Applications to Materials Characterization.- 3.6. Conclusion.- References.- Appendixes.- 4. Scanning Ultrasonic Microscopy with Phase Contrast.- 4.1. The Phase-Sensitive Acoustic Microscope.- 4.2. Topographical Measurements.- 4.3. Lens Characterization.- 4.4. Determination of the Elastic Properties of Small Samples.- 4.5. Determination of Elastic Constants of Single Crystals.- References.- 5. Ultrasonic Focusing with Time Reversal Mirrors.- 5.1. Introduction.- 5.2. Principles of Time Reversal Acoustics.- 5.3. Applications of Time Reversal Mirrors.- 5.4. The DORT Method (Décomposition de l'Opérateur de Retournement Temporel).- 5.5. Conclusion.- References.
