The 1st edition of the International Conference on Physical and Engineering Sciences (ICPES'22) is a major gathering of researchers, engineers and practitioners that creates opportunity for them to share ideas within the areas of Physical, Engineering Sciences, Modelling and Simulation from both theoretical and application perspectives. We especially welcome contributions that describe real-world problems, interdisciplinary research, experimental and/or theoretical studies and provide new insights into the fields of Physical and Engineering Sciences. Submissions of original papers concerning any of the areas listed below are also welcome. All accepted papers will be presented at the conference by one of the authors and published in the proceedings of MAASI with an ISBN. The acceptance will be based on quality, relevance, and originality. Presentation options include both oral and poster sessions. We plan to organize special sessions for case studies and commercial presentations, as well as tutorials focusing ontechnical or scientific matters. Companies that would like to present their products or methodologies, and researchers interested in demonstrating a demo or tutorial are encouraged to contact the conference secretariat. CONFERENCE AREAS The topic areas are further elaborated below, but the sub-topics are not exhaustive. Authors may address one or more of the listed sub-topics, while being free to also explore unlisted, relevant sub-topics that align with one of the following main topic areas: - PHYSICAL SCIENCES
- ENGINEERING SCIENCES
- MODELLING AND SIMULATION
- PHYSICS EDUCATION
Registration Fees Open Access Licence These conference proceedings provide immediate open access to its content under the CC-BY <a href="https://creativecommons.org/l
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Sprache
Verlagsort
Zielgruppe
Für Beruf und Forschung
US School Grade: College Graduate Student
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ISBN-13
978-83-67405-24-9 (9788367405249)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
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