1. An Introduction to Tape Automated Bonding Technology.- (Hewlett-Packard, San Jose CA).- 2. Stress Analysis for Component-Populated Circuit Cards.- (State University of New York, Binghamton NY).- 3. Modeling Concepts for the Vibration Analysis of Circuit Cards.- (State University of New York, Binghamton NY).- 4. Power Technology Packaging for the 90s.- (IBM Corporation, Endicott NY).- 5. Recent Developments in Thermal Technology for Electronics Packaging.- (IBM Corporation, Poughkeepsie NY).- 6. Heat Sinks in Forced Convection Cooling.- (State University of New York, Binghamton NY).- 7. Diamond Thin Films: Applications in Electronics Packaging.- (Air Products & Chemicals Inc, Allentown PA).- 8. Low Dielectric Materials for Packaging High Speed Electronics.- (DuPont Electronics, Wilmington DE).- 9. Integrated Optical Devices Based on Silica Waveguide Technology.- (Photonic Integration Research Inc, Columbus OH).- 10. Electrostatic and Electrical Overstress Damage in Silicon MOSFET Devices and GaAs MESFET Structures.- (Loughborough University of Technology, U.K.).- 11. Cleaning Surface Mount Assemblies: the Challenge of Finding a Substitute for CFC-113.- (Allied Signal Inc, Melrose IL).- 12. Electrical Bonding of Connectors on Jet Engine Electronics.- (General Electric Company, Johnson City NY).- 13. Parameterization of Fine Pitch Processing.- (Universal Instruments, Kirkwood NY).- 14. Electronics Packaging/Interconnect: An Industry in Transition.- (Allied Signal Inc, Morristown NJ).
