Addresses methods for measuring the properties of IC packages. Chapters include examples of the different analytical techniques used to measure the IC characteristics, and how to identify problems in IC packaging.
Reihe
Sprache
Verlagsort
Verlagsgruppe
Elsevier Science & Technology
Zielgruppe
Für höhere Schule und Studium
Für Beruf und Forschung
Illustrationen
Maße
Höhe: 152 mm
Breite: 229 mm
Gewicht
ISBN-13
978-0-7506-9267-0 (9780750692670)
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Schweitzer Klassifikation
IC packaging reliability; mold compound adhesion and strength; mechanical stress in IC packages; moisture sensitivity of plastic packages; thermal management in IC packages; electrical performance of IC packages; solderability; hermeticity; advanced interconnect technology.
