Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
Rezensionen / Stimmen
This excellent new edition of an industry standard handbook well presents the important aspects of soldering for printed circuits and surface mount technology. - IEEE Electrical Insulation Magazine, December 1996
Auflage
Sprache
Verlagsort
Verlagsgruppe
Kluwer Academic Publishers Group
Zielgruppe
Für höhere Schule und Studium
Für Beruf und Forschung
Research
Produkt-Hinweis
Fadenheftung
Gewebe-Einband
Illustrationen
Maße
Höhe: 237 mm
Breite: 163 mm
Dicke: 35 mm
Gewicht
ISBN-13
978-0-442-01206-9 (9780442012069)
Schweitzer Klassifikation
Design for good soldering and cleaning; Storage, kitting, assembly and presolder operations; Soldering and cleaning materials; The wave soldering process and the equipment; Surface mount technology; Solder paste technology; Reflow soldering for surface mounting; Cleaning materials, processes, and equipment; Trouble-shooting the printed circuit; Quality and inspection; Touch-up and repair; Process economy and managing the line; Index.
