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Distributed Embedded Systems: Design, Middleware and Resources

IFIP 20th World Computer Congress, TC10 Working Conference on Distributed and Parallel Embedded Systems (DIPES 2008), September 7-10, 2008, Milano, Italy
Springer (Verlag)
Erschienen am 19. November 2010
Buch
Softcover
XVI, 226 Seiten
978-1-4419-3505-2 (ISBN)
106,99 €inkl. 7% MwSt.
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