This book provides a comprehensive introduction to embedded flash memory, describing the history, current status, and future projections for technology, circuits, and systems applications. The authors describe current main-stream embedded flash technologies from floating-gate 1Tr, floating-gate with split-gate (1.5Tr), and 1Tr/1.5Tr SONOS flash technologies and their successful creation of various applications. Comparisons of these embedded flash technologies and future projections are also provided. The authors demonstrate a variety of embedded applications for auto-motive, smart-IC cards, and low-power, representing the leading-edge technology developments for eFlash. The discussion also includes insights into future prospects of application-driven non-volatile memory technology in the era of smart advanced automotive system, such as ADAS (Advanced Driver Assistance System) and IoE (Internet of Everything). Trials on technology convergence and future prospects of embedded non-volatile memory in the new memory hierarchy are also described.
- Introduces the history of embedded flash memory technology for micro-controller products and how embedded flash innovations developed;
- Includes comprehensive and detailed descriptions of current main-stream embedded flash memory technologies, sub-system designs and applications;
- Explains why embedded flash memory requirements are different from those of stand-alone flash memory and how to achieve specific goals with technology development and circuit designs;
- Describes a mature and stable floating-gate 1Tr cell technology imported from stand-alone flash memory products - that then introduces embedded-specific split-gate memory cell technologies based on floating-gate storage structure and charge-trapping SONOS technology and their eFlash sub-system designs;
- Describes automotive and smart-IC card applications requirements and achievements in advanced eFlash beyond 4
0nm node.
Reihe
Auflage
Softcover reprint of the original 1st ed. 2018
Sprache
Verlagsort
Verlagsgruppe
Springer International Publishing
Zielgruppe
Illustrationen
192
70 s/w Abbildungen, 192 farbige Abbildungen
VIII, 247 p. 262 illus., 192 illus. in color.
Maße
Höhe: 235 mm
Breite: 155 mm
Dicke: 15 mm
Gewicht
ISBN-13
978-3-319-85624-7 (9783319856247)
DOI
10.1007/978-3-319-55306-1
Schweitzer Klassifikation
Hideto Hidaka (M'00) received the B.S., M.S., and Ph.D. degrees in electronic engineering from the University of Tokyo, Tokyo, Japan, in 1981, 1983, and 1994, respectively. In 1983 he joined Mitsubishi Electric Corp. and then transferred to Renesas Technology Corp., renamed to Renesas Electronics Corp., where he is now the Chief Technology Officer and Senior Vice President of Renesas Electronics Corporation since July 1, 2015. Hidaka leads the technology strategy and technology development work of the entire Renesas Group. His extensive personal connections with leaders in the field of semiconductor technology development, his extensive track record in the field, and his experience supervising design work on the world's leading MCUs enable him to make a major contribution to the future growth of Renesas and in particular to technological innovation. Subsequently, he supervised development of microcontrollers (MCUs) with on-chip flash memory at Renesas Technology Corp. and Renesas Electronics Corporation. After joining Mitsubishi Electric Corporation as a member of the LSI Laboratory, he worked on the development of memory-related products such as DRAM and embedded DRAM (eDRAM). Hidaka has been an active member of several international scientific and technical societies in the semiconductor circuit field (including IEEE and IEICE) and served as the Chairman of the IEEE International Solid-State Circuits Conference (ISSCC), which is highly regarded in the industry as the Olympic Games of Semiconductors.
