This handbook is a complete, comprehensive reference to all aspects of electronic packaging, from fundamentals (Part 1) to systems (Part III). Increasingly, it is the package - not the integrated circuit - that is the limiting factor in modern, high-density, high performance electronic systems. This handbook provides in-depth coverage of this interdisciplinary field, combinating electrical, electronics, mechanical and materials principles and techniques.
Sprache
Verlagsort
Verlagsgruppe
McGraw-Hill Education - Europe
Zielgruppe
Illustrationen
Maße
Höhe: 250 mm
Breite: 157 mm
ISBN-13
978-0-07-026684-1 (9780070266841)
Copyright in bibliographic data is held by Nielsen Book Services Limited or its licensors: all rights reserved.
Schweitzer Klassifikation
Part 1: Materials for electronic packaging; thermal management; connectors and interconnection devices; wiring and cabling for electronic packaging; solders and soldering. Part 2: Packaging and interconnecting of integrated circuits and semiconductor devices; hubrid microelectronic packaging; rigid and flexible printed wiring boards; surface mount technology. Part 3: Packaging of high speed digital electronic systems; microwave electronic systems; packaging of electro-optical systems; packaging of military and aerospace electronic systems; computer-aided design and manufacturing.
