The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Auflage
Sprache
Verlagsort
Verlagsgruppe
Kluwer Academic Publishers Group
Zielgruppe
Für höhere Schule und Studium
Für Beruf und Forschung
Research
Illustrationen
Maße
Höhe: 235 mm
Breite: 157 mm
Dicke: 28 mm
Gewicht
ISBN-13
978-0-442-01505-3 (9780442015053)
Schweitzer Klassifikation
Foreword; Acknowldgement; Introduction: the mechanics of soldere alloy interconnect; Microstructural influences on the mechanical properties of solder; Interfaces and intermetallics; Constitutivemodels; Prediction of solder joint geometry; Life prediction and accelerated testing; Thermomechanical modeling of solder joints - numerical considerations; Applications - through-hole; Surface mount solder joints under thermal, mechanical, and vibration conditions; Index
