Classical applications of vacuum in the semiconductor industry have until recently involved only inert and clean gases. This situation has changed radically because the new technologies, used for deposition (LPCVD...) as well as for plasma etching, all involve the use of dangerous, poisonous, toxic or/and corrosive gases. Both the users and the manufacturers of vacuum pumps are now faced with new problems involving: Personnel safety and environment protection; Corrosion in vacuum pumps and peripherals; Reliability and serviceability of the equipment; In situ dust contamination of processed wafers, etc. This volume provides the first complete user oriented overview of all the problems that may be encountered with vacuum systems during semiconductor wafer processing. An up-to-date report of oil free vacuum pumps is also included.
Classical applications of vacuum in the semiconductor industry have until recently involved only inert and clean gases. This situation has changed radically because the new technologies, used for deposition (LPCVD...) as well as for plasma etching, all involve the use of dangerous, poisonous, toxic or/and corrosive gases. Both the users and the manufacturers of vacuum pumps are now faced with new problems involving: Personnel safety and environment protection; Corrosion in vacuum pumps and peripherals; Reliability and serviceability of the equipment; In situ dust contamination of processed wafers, etc. This volume provides the first complete user oriented overview of all the problems that may be encountered with vacuum systems during semiconductor wafer processing. An up-to-date report of oil free vacuum pumps is also included.
Reihe
Sprache
Verlagsort
Verlagsgruppe
Elsevier Science & Technology
Zielgruppe
Für höhere Schule und Studium
Für Beruf und Forschung
Maße
Höhe: 230 mm
Breite: 150 mm
ISBN-13
978-0-444-42878-3 (9780444428783)
Copyright in bibliographic data is held by Nielsen Book Services Limited or its licensors: all rights reserved.
Schweitzer Klassifikation
1. Introduction. 2. High Vacuum Requirements for Wafer Processing: PVD. CVD. Plasma etching. Ion implantation. 3. Safety: Tightness means safety. Oxygen pumping. Servicing. Handling gases. Risks with pump exhaust lines. Monitoring. 4. Selecting a Vacuum Pump: Vacuum pumps classification. Ultimate vacuum. Pumping speed. Maximum compression ratio. Hydrocarbon emission. Crossover pressure. Vacuum pumps selectivity. Associating vacuum pumps. 5. Use of Oil Sealed Mechanical Pumps: Corrosion resistance. Oils for mechanical vacuum pumps. Exhaust connection. Bubbler. Use of the gas ballast. Effluents handling. 6. Use of Traps. Cold traps. Sorption traps. Ionic traps. The catalyser trap. 7. High Vacuum Pumps: The Roots pumps. Turbomolecular pumps. Cryopumps. Diffusion pumps. 8. Reducing Wafer Contamination. Hydrocarbon pollution. Dust pollution. 9. Vacuum Measurement and Pump Monitoring. Vacuum measurement. Pressure gauges used in microelectronics. Vacuum system monitoring. Partial pressure measurements. Flowmeters. References and Additional Reading. Appendices: Gases commonly used in electronics. High vacuum calculation (basic). Glossary of common terms used in wafer processing. Frontier equipment - the dry pumps. Subject Index.
