Solid Freeform and Additive Fabrication - 2000: Volume 625

This book, first published in 2000, brings together experts in the field to discuss developments in (solid freeform) SFF and additive methods for fabricating metals, ceramics, polymers, and composites. It focuses on processing-structure-property relationships and relevant materials modeling approaches. Methods ranging from laser chemical vapor deposition (LCVD) to ink-jet based processes are presented. The entire range of materials, i.e., polymeric, metallic and ceramic components for structural, biological, and electronic applications, are also addressed, as are applications of these advanced processing techniques. A joint session with Symposium V, Materials Development for Direct Write Technologies, is included in the proceedings and features materials approaches that are currently being developed for fabricating mesoscopic integrated conformal electronics (MICE). These papers describe materials and methods to fabricate passive electronic devices (such as conductors, insulators and capacitors) on conformal surfaces at temperatures below 400 degreesC. Topics include: direct metal fabrication; tooling and photo processing; direct patterning; composites and ceramics; and ceramics and solution processes.
 
This book, first published in 2000, brings together experts in the field to discuss developments in (solid freeform) SFF and additive methods for fabricating metals, ceramics, polymers, and composites. It focuses on processing-structure-property relationships and relevant materials modeling approaches. Methods ranging from laser chemical vapor deposition (LCVD) to ink-jet based processes are presented. The entire range of materials, i.e., polymeric, metallic and ceramic components for structural, biological, and electronic applications, are also addressed, as are applications of these advanced processing techniques. A joint session with Symposium V, Materials Development for Direct Write Technologies, is included in the proceedings and features materials approaches that are currently being developed for fabricating mesoscopic integrated conformal electronics (MICE). These papers describe materials and methods to fabricate passive electronic devices (such as conductors, insulators and capacitors) on conformal surfaces at temperatures below 400 degreesC. Topics include: direct metal fabrication; tooling and photo processing; direct patterning; composites and ceramics; and ceramics and solution processes.