Foreword, Preface, Acknowledgments, Introduction, Facts About SEMATECH, SEMATECH Qualification Plan, Part One: GAUGE STUDIES, Chapter 1: Introduction to Gauge Studies, Chapter 2: Prometrix RS35e Gauge Study in Five Two-Level Factors and One Three-Level Factor,Chapter 3: Calibration of an FTIR Spectrometer for Measuring Carbon, Chapter 4: Revelation of a Microbalance Warm-Up Effect, Chapter 5: GRR Methodology for Destructive Testing and Quantitative Assessment of Gauge Capability For One-Side Specifications, Part Two: PASSIVE DATA COLLECTION, Chapter 6: Introduction to Passive Data Collection, Chapter 7: Understanding the Nature of Variability in a Dry Etch Process, Chapter 8: Virgin Versus Recycled Wafers for Furnace Qualification: Is the Expense Justified?, Chapter 9: Identifying Sources of Variation in a Wafer Planarization Process, Chapter 10: Factors Which Affect the Number of Aerosol Particles Released by Clean Room Operators, Chapter 11: A Skip-Lot Sampling Plan Based on Variance Components for Photolithographic Registration Measurements, Chapter 12: Sampling to Meet a Variance Specification: Clean Room Qualification, Chapter 13: Snapshot: A Plot Showing Progress Through a Device Development Laboratory, Part Three: DESIGN OF EXPERIMENTS, Chapter 14: Introduction To Design Of Experiments, Chapter 15: Elimination of TiN Peeling During Exposure to CVD Tungsten Deposition Process Using Designed Experiments, Chapter 16: Modeling a Uniformity Bulls-Eye Inversion, Chapter 17: Using Fewer Wafers to Resolve Confounding in Screening Experiments, Chapter 18: Planarization by Chemical Mechanical Polishing: A Rate and Uniformity Study, Chapter 19: Use of Experimental Design to Optimize a Process for Etching Polycrystalline Silicon Gates, Chapter 20: Optimization of a Wafer Stepper Alignment System Using Robust Design, Chapter 21: Application of Semi-Empirical Model Building to the RTCVD of Polysilicon,Part Four: STATISTICAL PROCESS CONTROL, Chapter 22: Introduction to Statistical Process Control, Chapter 23: Removing Drift Effects When Calculating Control Limits, Chapter 24: Implementation of a Statistical Process Control Capability Strategy in the Manufacture of Raw Printed Circuit Boards for Surface Mount Technology, Chapter 25: Obtaining and Using Statistical Process Control Limits in the Semiconductor Industry, Part Five: EQUIPMENT RELIABILITY, Chapter 26: Introduction to Equipment Reliability, Chapter 27: Marathon Report for a Photolithography Exposure Tool,Chapter 28: Experimentation for Equipment Reliability Improvement, Chapter 29: How to Determine Component-Based Preventive Maintenance Plans, Part Six: COMPREHENSIVE CASE STUDY, Chapter 30: Introduction to Comprehensive Case Study, Chapter 31: Characterization of a Vertical Furnace Chemical Vapor Deposition (CVD) Silicon Nitride Process, Appendix: Introduction to Integrated Circuit Manufacturing, Glossary of Selected Statistical Terms, Index of Selected Statistical Terms.
