Organic Electronics - Materials, Manufacturing and Applications

Preface. Author List. I Introduction. 1 Organic Transistors (Gilles Horowitz). 1.1 Introduction. 1.2 Overview of the Organic Thin film Transistor. 1.2.1 Are Organic "Semiconductors" Real Semiconductors? 1.2.2 Thin film Transistor Architecture. 1.2.3 Operating Mode. 1.2.4 Thickness of the Channel. 1.3 Contact Resistance. 1.3.1 Contact Resistance Extraction. 1.3.2 Origin of Contact Resistance. 1.4 Charge Transport. 1.5 Fabrication Techniques. 1.6 The Materials. 1.6.1 Polymers. 1.6.2 Small Molecules. 1.6.3 n Type Semiconductors. 1.6.4 Single Crystals. 1.6.5 Insulators. 1.7 Concluding Remarks. Acknowledgements. References. II Advanced Materials for Organic Electronics. 2 High performance Pentacene Transistors (Tommie Kelley). 2.1 Introduction. 2.2 Routes to Performance Improvement. 2.2.1 Purification. 2.2.2 Device Evolution. 2.2.3 Structural Perfection. 2.2.4 Device Architecture. 2.2.5 Interfacial Control. 2.3 Structure Property Relationships. 2.4 Continuing Reports of High Mobilities. 2.5 Performance in Practice. 2.6 The Future of High performance Organic Transistors. References. 3 Engineered Pentacenes (John E. Anthony). 3.1 Introduction. 3.2 Reversible Functionalization. 3.3 2,3,9,10 Tetrasubstituted and 2,3 Disubstituted Pentacenes: End substituted Derivatives. 3.4 Peri functionalized Pentacene. 3.5 Pentacene Functionalized at Both peri and End Positions. 3.6 Heteropentacenes. 3.7 Conclusion. References. 4 Organic Semiconductors Based on Polythiophene and Indolo[3,2 b]carbazole (Beng S. Ong, Yiliang Wu, and Yuning Li). 4.1 Introduction. 4.2 Issues and Challenges. 4.3 Structural Considerations. 4.4 Polythiophene Semiconductors. 4.4.1 High performance Polythiophene Design. 4.4.2 Polydialkylterthiophenes. 4.4.3 Polydialkylquaterthiophenes. 4.4.4 Polythiophene Nanoparticles. 4.4.5 Inkjet Patterned TFT Arrays. 4.5 Indocarbazole Designs. 4.6 Summary and Prospects. Acknowledgements. References. 5 Electrical and Environmental Stability of Polymer Thin film Transistors (Alberto Salleo and Michael L. Chabinyc). 5.1 Introduction. 5.2 Charge Trapping in TFTs. 5.2.1 General Considerations. 5.2.2 Bias Stress in Organic Transistors. 5.3 Bias Stress in Polyfluorene and Polythiophene TFTs. 5.3.1 Reversible Bias Stress. 5.3.2 Long lived Bias Stress. 5.3.3 Dependence of Bias Stress on Operating Conditions; Lifetime Predictions. 5.3.4 A Microscopic Theory of Bias Stress. 5.4 Chemical Effects on Stability Defects and Impurities. 5.4.1 Introduction. 5.4.2 Defects in Molecular Structure. 5.4.2.1 Defects from Synthesis. 5.4.2.2 Photo induced Defects. 5.4.3.1 Thermochemical Analysis. 5.4.3.2 Oxygen. 5.4.3.3 Water. 5.4.3.4 Organic Solvents. 5.4.3.5 Inorganic Impurities. 5.4.3 Impurities. 5.4.4 Studies of TFT Lifetime. 5.5 Conclusion. Acknowledgments. References. 6 Gate Dielectrics (Marcus Halik). 6.1 Introduction. 6.2 The Impact of Gate Dielectrics on the Electrical Functionality of Organic TFTs. 6.3 Insulating Materials An Overview. 6.3.1 Inorganic Gate Dielectrics. 6.3.2 Polymer Gate Dielectrics. 6.3.3 Self Assembled Monolayer Gate Dielectrics. 6.3.4 Multi layer and Multi component Gate Dielectrics. 6.3.5 Multifunctional Dielectrics. 6.4 Application related Aspects of Dielectrics. 6.4.1 Poly 4 vinylphenol Dielectrics. 6.4.2 The Self assembled Monolayer Approach. References. 7 Advanced Flexible Polymeric Substrates (William A. MacDonald). 7.1 Introduction. 7.2 Polyester Substrates. 7.3 Properties of Base Substrates. 7.3.1 Optical Properties. 7.3.2 Birefringence. 7.3.3 Thermal Properties. 7.3.4 Solvent Resistance. 7.3.5 Surface Quality. 7.3.6 Mechanical Properties. 7.3.7 Summary of Key Properties of Base Substrates. 7.4 Multilayer Structures. 7.5 Film in Application. Acknowledgments. References. III Manufacturing for Organic Electronics. 8 Reel to reel Vacuum Metallization (Roland Treutlein, Martin Bergsmann, and Carl J. Stonley). 8.1 Reel to reel Vacuum Metallization. 8.1.1 The Metallization Process. 8.1.1.1 Evaporation Sources. 8.1.1.2 Pretreatment and Cleaning of the Web Substrate. 8.1.1.3 PVD Process Flow. 8.1.1.4 Typical Process Times, Rates, and Quantities. 8.1.1.5 Transfer Metallization. 8.1.1.6 Pattern evaporated Layers. 8.1.2 Properties of the Evaporated Layer. 8.1.2.1 Structure. 8.1.2.2 Layer Thickness (Conductivity). 8.1.2.3 Barrier. 8.1.2.4 Light Barrier. 8.1.3 Environmental Benefits of Vacuum Evaporated Layers. 8.1.4 Applications of Metallized Films. 8.1.4.1 Barrier Packaging. 8.1.4.2 Decorative Applications. 8.1.4.3 Functional Layers. 8.1.4.4 Polymer Electronic Substrates. 8.1.5 Market Analysis. References. 9 Organic Vapor Phase Deposition (Michael Heuken and Nico Meyer). 9.1 Introduction. 9.1.1 The Principle of OVPD. 9.1.2 Close Coupled Showerhead Technology. 9.2 Deposition of Organic Thin Films. 9.2.1 Process Control in OVPD. 9.2.2 Co deposition and Doping in OVPD. 9.2.3 Controlled Morphology and Layer Interfaces in OVPD. 9.3 Electronic Devices by OVPD. 9.3.1 OLEDs Made by OVPD. 9.3.2 Organic Photovoltaics by OVPD. 9.3.3 Organic Thin film Transistors by OVPD. 9.4 Full color OLED Displays. 9.4.1 Micropatterning by use of Shadow Masks. 9.4.2 Mask less Processes. 9.5 Material Properties of Organic Molecules for Use in OVPD. 9.6 Summary. Acknowledgment. References. 10 Thermal Imaging and Micro contact Printing (Hee Hyun Lee, John Rogers, and Graciela Blanchet). 10.1 Introduction. 10.2 Building Blocks. 10.3 Printing and Patterning Techniques. 10.3.1 Thermal Imaging. 10.3.2 Printed Devices: From TFTs to Large area Backplanes. 10.4 Printable Materials. 10.4.1 Polyaniline Nanotube Composites: A High resolution Printable Conductor. 10.5 Micro contact Printing. 10.5.1 Contact Printing with High resolution Stamps. 10.5.1.1 High resolution Stamps. 10.5.2 Micro contact Printing. 10.5.3 Nanotransfer Printing. 10.6 Large Area Stamps, Molds, and Photomasks for Soft Lithography. 10.6.1 Micro contact Printing: A Path to Reel to reel Electronics. 10.6.2 Inexpensive Approaches to Large area Printing. 10.6.3 Registration Using the Lock and key Mechanism in Soft Imprinting. 10.7 Conclusions. Acknowledgments. References. 11 Thin film Transistor Fabrication by Digital Lithography (William S. Wong, Jurgen H. Daniel, Michael L. Chabinyc, Ana Claudia Arias, Steven E. Ready, and Rene Lujan). 11.1 Introduction. 11.2 Jet printed Patterning for Thin film Transistor Processing. 11.2.1 Introduction. 11.2.2 Jet printed Phase change Etch Masks. 11.3 Digital Lithography. 11.3.1 Digital Lithography for TFT Device Fabrication. 11.3.2 Thin film Transistor Device Structures. 11.3.2.1 Amorphous Silicon TFTs. 11.3.2.2 Polymeric TFTs by Digital Lithography. 11.3.3 Thin film Transistor Device Characteristics. 11.3.3.1 a Si:H TFTs. 11.3.3.2 Printed Polymeric TFTs. 11.4 TFTs on Flexible Substrates. 11.4.1 Introduction. 11.4.2 TFT Pixel Design Considerations. 11.4.3 Digital Lithography for Flexible Backplanes. 11.5 Display Applications with Print patterned Backplanes. 11.6 Conclusions. Acknowledgments. References. 12 Manufacturing of Organic Transistor Circuits by Solution based Printing (Henning Sirringhaus, Christoph W. Sele, Timothy von Werne, and Catherine Ramsdale). 12.1 Introduction to Printed Organic Thin Film Transistors. 12.2 Overview of Printing based Manufacturing Approaches for OTFTs. 12.2.1 Screen Printing. 12.2.2 Offset Printing. 12.2.3 Gravure Printing. 12.2.4 Flexography. 12.2.5 Inkjet Printing. 12.2.6 Laser based Dry printing Techniques. 12.2.7 Other Nonlithographic Manufacturing Approaches. 12.3 High resolution, Self aligned Inkjet Printing. 12.3.1 Self aligned Printing by Selective Surface Treatment. 12.3.2 Self aligned Printing by Surface Segregation. 12.3.3 Self aligned Printing by Autophobing. 12.4 Performance and Reliability of Solution processed OTFTs for Applications in Flexible Displays. 12.5 Conclusions. Acknowledgments. References. IV Devices, Applications, and Products. 13 From Transistors to Large scale Integrated Circuits (Gerwin H. Gelinck, Erik van Veenendaal, Eduard J. Meijer, Eugenio Cantatore, H. Edzer A. Huitema, Pieter van Lieshout, Fred J. Touwslager, Alwin W. Marsman, and Dago M. de Leeuw). 13.1 Introduction. 13.2 Discrete Devices. 13.2.1 Basic Device Operation of Organic Transistor. 13.2.2 Current Voltage Characteristics. 13.2.3 Capacitance Voltage Characteristics. 13.3 Fabrication and Characterization of Integrated Circuits. 13.3.1 Fabrication. 13.3.2 Modeling. 13.3.3 Analysis of Inverters. 13.3.4 Analysis of Integrated Circuits. Acknowledgments. References. 14 Roll up Active matrix Displays (H. Edzer A. Huitema, Gerwin H. Gelinck, Erik van Veenendaal, Fred J. Touwslager, and Pieter J. G. van Lieshout). 14.1 Introduction. 14.1.1 Non rigid Display Research and Development Overview. 14.2 Rollable Active matrix Backplane Technology. 14.3 Roll up Active matrix Backplane Design. 14.3.1 Field effect Mobility Effects. 14.3.2 Leakage Current Effects. 14.4 The Electronic Ink Film. 14.5 Roll up Display Integration. 14.6 Functional Active matrix Roll up Displays. 14.7 Roll up Display Device Concepts. 14.8 Towards a System on plastic: Driver Integration. 14.8.1 Row Driver Integration. 14.8.2 Stand alone Shift Registers. 14.8.3 Integrated Shift Registers. Acknowledgment. References. 15 Active matrix Light emitting Displays (Shelby F. Nelson and Lisong Zhou). 15.1 Introduction. 15.2 OLED Pixel Differences from LCDs. 15.3 Complex Pixel Design. 15.4 Practical Design. 15.5 AIM SPICE Simulation of Pentacene TFT driven OLEDs. 15.6 Fabrication Process. 15.7 Device Passivation. 15.8 PVA and Parylene. 15.9 Pentacene TFT Uniformity. 15.10 Stability. 15.11 Integration of TFTs and OLEDs. 15.12 Flexible OLED Display. 15.13 Substrate Selection and Mounting. 15.14 Thermal Dimensional Stability. 15.15 Surface Quality. 15.16 Chemical Resistance. 15.17 Fabrication Process. 15.18 Display Results. 15.19 Conclusion. References. 16 Large area Detectors and Sensors (Takao Someya and Takayasu Sakurai). 16.1 Introduction. 16.2 Large area Pressure Sensors. 16.3 Organic Transistor based Integrated Circuits. 16.4 Bending Experiments of Organic Transistors. 16.5 High temperature Operation of Organic Transistors. 16.6 Sheet Image Scanners. 16.7 Three dimensional Integrated Circuits. 16.8 Future Prospects of Large area Electronics. 16.9 Remaining Issues. 16.10 Conclusions. Acknowledgments. References. 17 Organic Semiconductor based Chemical Sensors (Howard E. Katz and Jia Huang). 17.1 Background. 17.2 Inorganic and Nanostrctured Semiconductor Sensors. 17.3 Sensitive Organic Field effect Transistors. 17.4 Mechanistic Rationale. 17.5 Conclusion. References. Index.