
ESD Basics
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Dr. Steven H. Voldman, IEEE Fellow, Vermont, USA. Prolific Wiley writer, Dr. Steven Voldman has been involved with ESD work since 1991. He has been Chairman of the ESD Association WG 5.5 on TLP testing since 2001 and he was Chairman of the SEMATECH ESD Working Group on ESD Technology from 1995 until 1998.
Dr. Voldman worked 25 years at IBM before working at Qimonda in 2007 and then TSMC Corporation in 2008. Currently he holds 181 patents in the areas of ESD and latchup, and has 125 pending. His fields of expertise are electrostatic discharge (ESD) protection, latchup, ESD testing and ESD design. To date, he has worked on many design architectures from SRAM, DRAM, ASICs, Microprocessors, NVRAMs, image processing designs and power technology.
Inhalt
About the Author xiii
Preface xv
Acknowledgments xvii
1 Fundamentals of Electrostatics 1
1.1 Introduction 1
1.2 Electrostatics 1
1.2.1 Thales of Miletus and Electrostatic Attraction 2
1.2.2 Electrostatics and the Triboelectric Series 3
1.2.3 Triboelectric Series and Gilbert 4
1.2.4 Triboelectric Series and Gray 4
1.2.5 Triboelectric Series and Dufay 4
1.2.6 Triboelectric Series and Franklin 5
1.2.7 Electrostatics - Symmer and the Human Body Model 5
1.2.8 Electrostatics - Coulomb and Cavendish 5
1.2.9 Electrostatics - Faraday and the Ice Pail Experiment 5
1.2.10 Electrostatics - Faraday and Maxwell 6
1.2.11 Electrostatics - Paschen 6
1.2.12 Electrostatics - Stoney and the "Electron" 6
1.3 Triboelectric Charging - How does it Happen? 7
1.4 Conductors, Semiconductors, and Insulators 8
1.5 Static Dissipative Materials 8
1.6 ESD and Materials 9
1.7 Electrification and Coulomb's Law 9
1.7.1 Electrification by Friction 10
1.7.2 Electrification by Induction 10
1.7.3 Electrification by Conduction 10
1.8 Electromagnetism and Electrodynamics 11
1.9 Electrical Breakdown 11
1.9.1 Electrostatic Discharge and Breakdown 11
1.9.2 Breakdown and Paschen's Law 12
1.9.3 Breakdown and Townsend 12
1.9.4 Breakdown and Toepler's Law 13
1.9.5 Avalanche Breakdown 13
1.10 Electroquasistatics and Magnetoquasistatics 15
1.11 Electrodynamics and Maxwell's Equations 16
1.12 Electrostatic Discharge (ESD) 16
1.13 Electromagnetic Compatibility (EMC) 16
1.14 Electromagnetic Interference (EMI) 16
1.15 Summary and Closing Comments 17
References 17
2 Fundamentals of Manufacturing and Electrostatics 21
2.1 Materials, Tooling, Human Factors, and Electrostatic Discharge 22
2.1.1 Materials and Human Induced Electric Fields 23
2.2 Manufacturing Environment and Tooling 23
2.3 Manufacturing Equipment and ESD Manufacturing Problems 23
2.4 Manufacturing Materials 24
2.5 Measurement and Test Equipment 24
2.5.1 Manufacturing Testing for Compliance 25
2.6 Grounding and Bonding Systems 27
2.7 Worksurfaces 27
2.8 Wrist Straps 28
2.9 Constant Monitors 28
2.10 Footwear 28
2.11 Floors 28
2.12 Personnel Grounding with Garments 29
2.12.1 Garments 29
2.13 Air Ionization 29
2.14 Seating 29
2.15 Carts 30
2.16 Packaging and Shipping 31
2.16.1 Shipping Tubes 31
2.16.2 Trays 32
2.17 ESD Identification 32
2.18 ESD Program Management - Twelve Steps to Building an ESD Strategy 32
2.19 ESD Program Auditing 33
2.20 ESD On-Chip Protection 33
2.21 Summary and Closing Comments 34
References 34
3 ESD, EOS, EMI, EMC and Latchup 39
3.1 ESD, EOS, EMI, EMC and Latchup 39
3.1.1 ESD 39
3.1.2 EOS 40
3.1.3 EMI 40
3.1.4 EMC 41
3.1.5 Latchup 41
3.2 ESD Models 41
3.2.1 Human Body Model (HBM) 41
3.2.2 Machine Model (MM) 43
3.2.3 Cassette Model 45
3.2.4 Charged Device Model (CDM) 46
3.2.5 Transmission Line Pulse (TLP) 46
3.2.6 Very Fast Transmission Line Pulse (VF-TLP) 50
3.3 Electrical Overstress (EOS) 50
3.3.1 EOS Sources - Lightning 51
3.3.2 EOS Sources - Electromagnetic Pulse (EMP) 52
3.3.3 EOS Sources - Machinery 52
3.3.4 EOS Sources - Power Distribution 52
3.3.5 EOS Sources - Switches, Relays and Coils 53
3.3.6 EOS Design Flow and Product Definition 53
3.3.7 EOS Sources - Design Issues 54
3.3.8 EOS Failure Mechanisms 55
3.4 EMI 57
3.5 EMC 57
3.6 Latchup 58
3.7 Summary and Closing Comments 59
References 59
4 System Level ESD 65
4.1 System Level Testing 65
4.1.1 System Level Testing Objectives 66
4.1.2 Distinction of System and Component Level Testing Failure Criteria 66
4.2 When Systems and Chips Interact 67
4.3 ESD and System Level Failures 68
4.3.1 ESD Current and System Level Failures 68
4.3.2 ESD Induced E- and H-Fields and System Level Failures 69
4.4 Electronic Systems 70
4.4.1 Cards and Boards 70
4.4.2 System Chassis and Shielding 71
4.5 System Level Problems Today 71
4.5.1 Hand Held Systems 71
4.5.2 Cell Phones 71
4.5.3 Servers and Cables 72
4.5.4 Laptops and Cables 74
4.5.5 Disk Drives 74
4.5.6 Digital Cameras 75
4.6 Automobiles, ESD, EOS, and EMI 77
4.6.1 Automobiles and ESD - Ignition Systems 77
4.6.2 Automobiles and EMI - Electronic Pedal Assemblies 77
4.6.3 Automobiles and Gas Tank Fires 78
4.6.4 Hybrids and Electric Cars 78
4.6.5 Automobiles in the Future 79
4.7 Aerospace Applications 80
4.7.1 Airplanes, Partial Discharge, and Lightning 80
4.7.2 Satellites, Spacecraft Charging, and Single Event Upset (SEU) 81
4.7.3 Space Landing Missions 81
4.8 ESD and System Level Test Models 83
4.9 IEC 61000-4-2 83
4.10 Human Metal Model (HMM) 83
4.11 Charged Board Model (CBM) 86
4.12 Cable Discharge Event (CDE) 87
4.12.1 Cable Discharge Event (CDE) and Scaling 89
4.12.2 Cable Discharge Event (CDE) - Cable Measurement Equipment 89
4.12.3 Cable Configuration - Test Configuration 92
4.12.4 Cable Configuration - Floating Cable 92
4.12.5 Cable Configuration - Held Cable 92
4.12.6 Cable Discharge Event (CDE) - Peak Current vs. Charged Voltage 92
4.12.7 Cable Discharge Event (CDE) - Plateau Current vs Charged Voltage 92
4.13 Summary and Closing Comments 93
References 93
5 Component Level Issues - Problems and Solutions 97
5.1 ESD Chip Protection - The Problem and the Cure 97
5.2 ESD Chip Level Design Solutions - Basics of Design Synthesis 98
5.2.1 ESD Circuits 101
5.2.2 ESD Signal Pin Protection Networks 101
5.2.3 ESD Power Clamp Protection Networks 103
5.2.4 ESD Power Domain-to-Domain Circuitry 103
5.2.5 ESD Internal Signal Line Domain-to-Domain Protection Circuitry 104
5.3 ESD Chip Floor Planning - Basics of Design Layout and Synthesis 105
5.3.1 Placement of ESD Signal Pin HBM Circuitry 106
5.3.2 Placement of ESD Signal Pin CDM Circuitry 107
5.3.3 Placement of ESD Power Clamp Circuitry 107
5.3.4 Placement of ESD VSS-to-VSS Circuitry 109
5.4 ESD Analog Circuit Design 109
5.4.1 Symmetry and Common Centroid Design for ESD Analog Circuits 110
5.4.2 Analog Signal Pin to Power Rail ESD Network 111
5.4.3 Common Centroid Analog Signal Pin to Power Rail ESD Network 111
5.4.4 Co-synthesis of Common Centroid Analog Circuit and ESD Networks 112
5.4.5 Signal Pin-to-Signal Pin Differential Pair ESD Network 113
5.4.6 Common Centroid Signal Pin Differential Pair ESD Protection 113
5.5 ESD Radio Frequency (RF) Design 115
5.5.1 ESD Radio Frequency (RF) Design Practices 115
5.5.2 ESD RF Circuits - Signal Pin ESD Networks 121
5.5.3 ESD RF Circuits - ESD Power Clamps 123
5.5.4 ESD RF Circuits - ESD RF VSS-to-VSS Networks 126
5.6 Summary and Closing Comments 127
References 127
6 ESD in Systems - Problems and Solutions 129
6.1 ESD System Solutions from Largest to Smallest 129
6.2 Aerospace Solutions 129
6.3 Oil Tanker Solutions 130
6.4 Automobile Solutions 130
6.5 Computers - Servers 131
6.5.1 Servers - Touch Pads and Handling Procedures 131
6.6 Mother Boards and Cards 131
6.6.1 System Card Insertion Contacts 131
6.6.2 System Level Board Design - Ground Design 131
6.7 System Level "On Board" ESD Protection 133
6.7.1 Spark Gaps 134
6.7.2 Field Emission Devices (FED) 136
6.8 System Level Transient Solutions 140
6.8.1 Transient Voltage Suppression (TVS) Devices 141
6.8.2 Polymer Voltage Suppression (PVS) Devices 143
6.9 Package-Level Mechanical ESD Solutions - Mechanical "Crowbars" 144
6.10 Disk Drive ESD Solutions 145
6.10.1 In Line "ESD Shunt" 145
6.10.2 Armature - Mechanical "Shunt" - A Built-In Electrical "Crowbar" 145
6.11 Semiconductor Chip Level Solutions - Floor Planning, Layout, and Architecture 147
6.11.1 Mixed Signal Analog and Digital Floor Planning 147
6.11.2 Bipolar-CMOS-DMOS (BCD) Floor Planning 148
6.11.3 System-on Chip Design Floor Planning 148
6.12 Semiconductor Chip Solutions - Electrical Power Grid Design 149
6.12.1 HMM and IEC Specification Power Grid and Interconnect Design Considerations 150
6.12.2 ESD Power Clamp Design Synthesis - IEC 61000-4-2 Responsive ESD Power Clamps 151
6.13 ESD and EMC - When Chips Bring Down Systems 152
6.14 System Level and Component Level ESD Testing and System Level Response 152
6.14.1 Time Domain Reflection (TDR) and Impedance Methodology for ESD Testing 152
6.14.2 Time Domain Reflectometry (TDR) ESD Test System Evaluation 154
6.14.3 ESD Degradation System Level Method - Eye Tests 158
6.15 EMC and ESD Scanning 160
6.16 Summary and Closing Comments 163
References 164
7 Electrostatic Discharge (ESD) in the Future 167
7.1 What is in the Future for ESD? 167
7.2 Factories and Manufacturing 167
7.3 Photo-Masks and Reticles 168
7.3.1 ESD Concerns in Photo-Masks 169
7.3.2 Avalanche Breakdown in Photo-Masks 170
7.3.3 Electrical Model in Photo-Masks 171
7.3.4 Failure Defects in Photo-Masks 172
7.4 Magnetic Recording Technology 174
7.5 Micro-Electromechanical (MEM) Devices 176
7.5.1 ESD Concerns in Micro-Electromechanical (MEM) Devices 177
7.6 Micro-Motors 178
7.6.1 ESD Concerns in Micro-Motors 178
7.7 Micro-Electromechanical (MEM) RF Switches 180
7.7.1 ESD Concerns in Micro-Electromechanical (MEM) RF Switches 180
7.8 Micro-Electromechanical (MEM) Mirrors 182
7.8.1 ESD Concerns in Micro-Electromechanical (MEM) Mirrors 182
7.9 Transistors 183
7.9.1 Transistors - Bulk vs. SOI Technology 184
7.9.2 Transistors and FinFETs 185
7.9.3 ESD in FinFETs 185
7.10 Silicon Nanowires 187
7.11 Carbon Nanotubes 187
7.12 Future Systems and System Designs 188
7.13 Summary and Closing Comments 189
References 190
Glossary 195
ESD Standards 199
Index 203
Chapter 1
Fundamentals of Electrostatics
1.1 Introduction
We are all familiar with electrostatic discharge (ESD): shuffle your feet across a shag carpet in your favorite sneakers, touch a piece of metal, and zap! For a human being, we let out an “ouch!”; but for micro-electronics to nano-electronics, this can lead to product failures [1].
But, today, and in the future, static charge will remain an important industrial issue for the production of both electronic devices to systems. It is also an issue in fields of munitions, explosives, chemical, and material industries. Any industry where there is a risk of impact to quality, yield, degradation, or physical harm will be concerned with electrostatic discharge (ESD), electrical overstress (EOS), electromagnetic interference (EMI), and electromagnetic compatibility (EMC).
In this book, a short survey of ESD from manufacturing to product use will be shown. The text will discuss fundamentals of electrostatics, manufacturing electrostatic issues, component level issues, system level issues, to design.
So, where did all this all begin?
1.2 Electrostatics
The discovery of electrostatic attraction and electrostatic discharge is one of the world's earliest understandings of scientific thought and analysis. Its first discovery goes back to the early foundation of the problem of the nature of matter, astronomy, mathematics and foundation of Greek philosophy, and pre-dates the nature of matter.
1.2.1 Thales of Miletus and Electrostatic Attraction
Thales of Miletus, born in 624 B.C.E and died in 546 B.C.E, was the founder of the Ionian School (or Milesian School) and one of the Seven Wise Men of Ancient Greece in the Pre-Socratic era. Thales was an astronomer, mathematician, and philosopher. He was an inventor and an engineer. Thales of Miletus established a heritage of searching for knowledge for knowledge sake, development of the scientific method, establishment of practical methods, and the conjecture approach to questions of natural phenomenon. The Milesian School is regarded as establishing the critical method of questioning, debate, explanation, justification and criticism. The students of Thales included Euclid, Pythagoras, and Eudemus [2].
It was Thales of Miletus who was accredited with the discovery of the electrostatic attraction created after the material amber was rubbed. Thales noted after amber was rubbed, straw was attracted to the piece of amber. It was from this event, the Greek word for amber, ελεκτρoν (trans. electron) became associated with the electrical phenomenon.
Knowledge of Thales' ideas was common through writings of his disciples and notary Greek Philosophers. In De Anima 411 a7-8, Aristotle stated “Some think that the soul pervades the whole universe, when perhaps came Thales' view that everything is full of gods.” [3].
Electrostatic phenomenon pre-dated early thoughts of the nature of physical matter. Thales of Miletus's ESD experiments and study of electrostatic attraction was before the atomic schools of matter in Greece and Rome. Electrostatic phenomena and thought began before the Greek atomistic schools of Democritus (420 B.C.E.), and Epicurus (370 B. C.E.), and Roman School of Lucretius (50 B.C.E). Thales was deceased by the time the schools of atomic thought were active. On his tomb read, “Here in a narrow tomb Great Thales lie; Yet his renown for wisdom reached the skies [4].”
Robert A. Millikan, in the Introduction of his 1917 edition of “The Electron” [5] stated,
“Perhaps it is merely a coincidence that the man who first noticed rubbing of amber would induce in it a new and remarkable state now known as the state of electrification was also the man who first gave expression to the conviction that there must be some great unifying principle which links together all phenomena and is capable of making them rationally intelligible; that behind all the apparent variety and change of things there is some primordial element, out of which all things are made and the search for which must be the ultimate aim of all natural science. Yet if this be merely coincidence, at any rate to Thales of Miletus must belong a double honor. For he first correctly conceived and correctly stated, as far back as 600 B.C., the spirit which has actually guided the development of physics in all ages, and he also first described, though in a crude and imperfect way, the very phenomenon the study of which has already linked together several of the erstwhile isolated departments of physics, such as radiant heat, light, magnetism, and electricity, and has very recently brought us nearer to the primordial element than we have ever been before.”
J.H. Jeans, in the 1925 Fifth Edition of The Mathematical Theory of Electricity and Magnetism [6], wrote
“The fact that a piece of amber, on being rubbed, attracted to itself other small bodies, was known to the Greeks, the discovery of this fact being attributed to Thales of Miletus”
“A second fact, namely, that a certain mineral ore (lodestone) possessed the property of attracting iron, is mentioned by Lucretius. These two facts have formed the basis from which the modern science of Electromagnetism has grown.”
1.2.2 Electrostatics and the Triboelectric Series
With the death of Thales of Miletus, little progress proceeded on ESD phenomenon. Although history moved forward, the advancement of tribo-electric charging and electrostatic discharge phenomenon was slow relative to the time that passed. In Europe, mankind saw the Roman Empire, the Golden Age of Islam, the Middle Ages, the Black Death, the Renaissance, the Reformation, and the advancement of nation states. ESD phenomenon was discovered by Thales while China was undergoing the Zhou Dynasty. Asia underwent tremendous change with the Qin, Han, Sui, Tang, and Song, Yuan, and Ming dynastic periods, but there was no advancement of this field of knowledge.
With all this social change, insignificant growth in the understanding of electrostatic phenomenon increased until the eighteenth century. The interest in tribo-charging and electrostatic phenomenon became the luxury of scientists supported by the courts of Europe and laboratories of France and England.
So, how does tribo-charging happen?
When two materials come into contact, the atoms contained within the materials come into close contact. Figure 1.1 shows an example of two atoms of different materials. The nucleus is tightly bound, with neutrons and protons, and is positively charged. Strong interactions hold the neutrons and protons together. According to the Bohr model, the electrons orbit around the nucleus, and are drawn to the nucleus by the electrostatic attraction between the negative electrons and the positive nucleus. In a neutral un-charged atom, the number of protons and electrons are equal in number.
Figure 1.1 Tribo-charging of materials – physical contact
When two materials are in contact, charge transfer occurs through the friction or physical contact. An electron of the outer orbitals can transfer from one material to the second material. Figure 1.2 shows an example after the two materials are separated. In this case, the material that loses the electron becomes positively charged, and the material that gains the electron becomes negatively charged.
Figure 1.2 Tribo-charging of materials – separation
1.2.3 Triboelectric Series and Gilbert
Gilbert, in the seventeenth century, noted that interaction between a glass rod and silk produced the same phenomenon discussed by Thales of Miletus – materials when rubbed with silk became “amberized” [5]. Gilbert began construction of the earliest list of tribo-electrification.
1.2.4 Triboelectric Series and Gray
In the same period, Stephen Gray (1696–1736) thought of the concept of the division of materials according to its nature of removing or sustaining electrification [5]. He defined a class of materials which remove “amberization” as conductors, and the class of materials which allowed a body to retain its electrification as non-conductors, or insulators.
1.2.5 Triboelectric Series and Dufay
This work was followed by French physicist Dufay in 1733 discovering the same effect can be achieved with sealing wax and cat's fur and noted the effect was different from the glass rod [5]. Dufay first noted that there was an attractive and repulsive phenomenon between different materials, naming the opposite processes as “vitreous” and “resinous.”
1.2.6 Triboelectric Series and Franklin
Benjamin Franklin – the first American ESD engineer, in 1747, also identified two processes, which he divided into “positive” and “negative” processes. The “positive” process was the first process, discovered by Gilbert, any physical body was electrified positive if repelled by a glass rod which was rubbed with silk. The “negative” process is any body repelled from sealing wax which was rubbed with cat's fur, extending the work of Dufay.
In this time frame, many electrostatic scientists began recording the relationship of one body to another in the electrification process. Lists of materials of the times were ordered to construct the early tribo-electrification chart [6]
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