Electrical Modeling and Design for 3D System Integration
3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
Erschienen am 19. März 2012
224 Seiten
978-1-118-16675-8 (ISBN)
Beschreibung
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems
Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures.
Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through:
* The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems
* The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias
* Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations
* The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards
* An equivalent circuit model of through-silicon vias
* Metal-oxide-semiconductor capacitance effects of through-silicon vias
Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures.
Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through:
* The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems
* The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias
* Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations
* The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards
* An equivalent circuit model of through-silicon vias
* Metal-oxide-semiconductor capacitance effects of through-silicon vias
Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Weitere Details
Weitere Ausgaben
Person
ER-PING LI, PhD, holds an appointment as Chair Professor at Zhejiang University, China, and has also been a principal scientist and director at the Institute of High Performance Computing, Singapore. He is a Fellow of the IEEE and a Fellow of the Electromagnetics Academy. He has received numerous awards and honors in recognition of his professional work from the IEEE and other professional bodies. Dr. Li is a pioneer in the modeling and simulation for signal/power and EMC in integrated circuits and electronic systems packaging. He has chaired or spoken at numerous international conferences and universities, and has also served as editor to several IEEE Transactions.
Inhalt
Foreword xi
Preface xiii
1. Introduction 1
1.1 Introduction of Electronic Package Integration, 1
1.2 Review of Modeling Technologies, 6
1.3 Organization of the Book, 10
2. Macromodeling of Complex Interconnects in 3D Integration 16
2.1 Introduction, 16
2.2 Network Parameters: Impedance, Admittance, and Scattering Matrices, 19
2.3 Rational Function Approximation with Partial Fractions, 25
2.4 Vector Fitting (VF) Method, 29
2.5 Macromodel Synthesis, 41
2.6 Stability, Causality, and Passivity of Macromodel, 48
2.7 Macromodeling Applied to High-Speed Interconnects and Circuits, 79
2.8 Conclusion, 91
3. 2.5D Simulation Method for 3D Integrated Systems 97
3.1 Introduction, 97
3.2 Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems, 98
3.3 Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes, 127
3.4 Numerical Simulations for Finite Structures, 133
3.5 Modeling of 3D Electronic Package Structure, 142
3.6 Conclusion, 182
4. Hybrid Integral Equation Modeling Methods for 3D Integration 185
4.1 Introduction, 185
4.2 2D Integral Equation Equivalent Circuit (IEEC) Method, 186
4.3 3D Hybrid Integral Equation Method, 220
4.4 Conclusion, 238
5. Systematic Microwave Network Analysis for 3D Integrated Systems 241
5.1 Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair, 242
5.2 Parallel Plane Pair Model, 281
5.3 Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias, 305
6. Modeling of Through-Silicon Vias (TSV) in 3D Integration 331
6.1 Introduction, 331
6.2 Equivalent Circuit Model for TSV, 336
6.3 MOS Capacitance Effect of TSV, 351
6.4 Conclusion, 356
References, 358
Index 361
Preface xiii
1. Introduction 1
1.1 Introduction of Electronic Package Integration, 1
1.2 Review of Modeling Technologies, 6
1.3 Organization of the Book, 10
2. Macromodeling of Complex Interconnects in 3D Integration 16
2.1 Introduction, 16
2.2 Network Parameters: Impedance, Admittance, and Scattering Matrices, 19
2.3 Rational Function Approximation with Partial Fractions, 25
2.4 Vector Fitting (VF) Method, 29
2.5 Macromodel Synthesis, 41
2.6 Stability, Causality, and Passivity of Macromodel, 48
2.7 Macromodeling Applied to High-Speed Interconnects and Circuits, 79
2.8 Conclusion, 91
3. 2.5D Simulation Method for 3D Integrated Systems 97
3.1 Introduction, 97
3.2 Multiple Scattering Method for Electronic Package Modeling with Open Boundary Problems, 98
3.3 Novel Boundary Modeling Method for Simulation of Finite-Domain Power-Ground Planes, 127
3.4 Numerical Simulations for Finite Structures, 133
3.5 Modeling of 3D Electronic Package Structure, 142
3.6 Conclusion, 182
4. Hybrid Integral Equation Modeling Methods for 3D Integration 185
4.1 Introduction, 185
4.2 2D Integral Equation Equivalent Circuit (IEEC) Method, 186
4.3 3D Hybrid Integral Equation Method, 220
4.4 Conclusion, 238
5. Systematic Microwave Network Analysis for 3D Integrated Systems 241
5.1 Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair, 242
5.2 Parallel Plane Pair Model, 281
5.3 Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias, 305
6. Modeling of Through-Silicon Vias (TSV) in 3D Integration 331
6.1 Introduction, 331
6.2 Equivalent Circuit Model for TSV, 336
6.3 MOS Capacitance Effect of TSV, 351
6.4 Conclusion, 356
References, 358
Index 361
