The first detailed studies of electronic components reliability were undertaken to improve the performance of communications and navigational systems used by the American army. The techniques then developed were subsequently refined and applied to equipment used for many other applications where high reliability was of paramount importance - for example in civil airline electronic systems. The evolution of good and reliable products is the responsibility of technical and professional persons, engineers and designers. These individuals cannot succeed unless they are given adequate opportunity to apply their arts and mysteries so as to bring the end-product to the necessary level of satisfaction. Few managements, however, are yet aware of the far greater potential value of the reliability of their products or services. Yet customer satisfaction depends, in most cases, far more on the reliability of performance than on quality in the industrial sense. There was a time when reliable design could be prescribed simply as "picking good parts and using them right". Nowadays the complexity of systems, particularly electronic systems, and the demand for ultrahigh reliability in many applications mean that sophisticated methods based on numerical analysis and probability techniques have been brought to bear - particularly in the early stages of design - on determining the feasibility of systems.
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ISBN-13
978-3-642-58505-0 (9783642585050)
DOI
10.1007/978-3-642-58505-0
Schweitzer Klassifikation
1 Introduction.- 1.1 Definition of reliability.- 1.2 Historical development perspective.- 1.3 Quality and reliability.- 1.4 Economics and optimisation.- 1.5 Probability; basic laws.- 1.6 Specific terms.- 1.7 Failures types.- 1.8 Reliability estimates.- 1.9 "Bath-tub" failure curve.- 1.10 Reliability of electronic systems.- 1.11 Some examples.- References.- 2 State of the Art in Reliability.- 2.1 Cultural features.- 2.2 Reliability building.- 2.3 Reliability evaluation.- 2.4 Standardisation.- References.- 3 Reliability of Passive Electronic Parts.- 3.1 How parts fail.- 3.2 Resistors.- 3.3 Reliability of capacitors.- 3.4 Zinc oxide (ZnO) varistors [3.39]...[3.45].- 3.5 Connectors.- References.- 4 Reliability of Diodes.- 4.1 Introduction.- 4.2 Semiconductor diodes.- 4.3 Z diodes.- 4.4 Trans-Zorb diodes.- 4.5 Impatt (IMPact Avalanche and Transit-Time) diodes.- References.- 5 Reliability of Silicon Transistors.- 5.1 Introduction.- 5.2 Technologies and power limitations.- 5.3 Electrical characteristics.- 5.4 Reliability characteristics.- 5.5 Thermal fatigue.- 5.6 Causes of failures.- 5.7 The package problem.- 5.8 Accelerated tests.- 5.9 How to improve the reliability.- 5.10 Some recommendations.- References.- 6 Reliability of Thyristors.- 6.1 Introduction.- 6.2 Design and reliability.- 6.3 Derating.- 6.4 Reliability screens by General Electric.- 6.5 New technology in preparation: SITH.- References.- 7 Reliability of Integrated Circuits.- 7.1 Introduction.- 7.2 Reliability evaluation.- 7.3 Failure analysis.- 7.4 Screening and burn-in.- 7.5 Comparison between the IC families TTL Standard and TTL-LS.- 7.6 Application Specific Integrated Circuits (ASIC).- References.- 8 Reliability of Hybrids.- 8.1 Introduction.- 8.2 Thin-film hybrid circuits.- 8.3 Thick-film hybrids.- 8.4Thick-film versus thin-film hybrids.- 8.5 Reliability of hybrid ICs.- 8.6 Causes of failures.- 8.7 Influence of radiation.- 8.8 Prospect outlook of the hybrid technology.- 8.9 Die attach and bonding techniques.- 8.10 Failure mechanisms.- References.- 9 Reliability of Memories.- 9.1 Introduction.- 9.2 Process-related reliability aspects.- 9.3 Possible memories classifications.- 9.4 Silicon On Insulator (SOI) technologies.- 9.5 Failure frequency of small geometry memories.- 9.6 Causes of hardware failures.- 9.7 Characterisation testing.- 9.8 Design trends in microprocessor domain.- 9.9 Failure mechanisms of microprocessors.- References.- 10 Reliability of Optoelectronics.- 10.1 Introduction.- 10.2 LED reliability.- 10.3 Optocouplers.- 10.4 Liquid crystal displays.- References.- 11 Noise and Reliability.- 11.2 Excess noise and reliability.- 11.3 Popcorn noise.- 11.4 Flicker noise.- 11.5 Noise figure.- 11.6 Improvements in signal quality of digital networks.- References.- 12 Plastic Package and Reliability.- 12.1 Historical development.- 12.2 Package problems.- 12.3 Some reliabilistic aspects of the plastic encapsulation.- 12.4 Reliability tests.- 12.5 Reliability predictions.- 12.6 Failure analysis.- 12.7 Technological improvements.- 12.8 Can we use plastic encapsulated microcircuits (PEM) in high reliability applications?.- References.- 13 Test and Testability of Logic Ics.- 13.1 Introduction.- 13.2 Test and test systems.- 13.3 Input control tests of electronic components.- 13.4 LIC selection and connected problems.- 13.5 Testability of LICs.- 13.6 On the testability of electronic and telecommunications systems.- References.- 14 Failure Analysis.- 14.1 Introduction [14.1]...[14.25].- 14.2 The purpose of failure analysis.- 14.3 Methods of analysis.- 14.4 Failure causes.-14.5 Some examples.- References.- 15 Appendix.- 15.1 Software-package RAMTOOL++ [15.1].- 15.2 Failure rates for components used in telecommunications.- 15.3 Failure types for electronic components [15.2].- 15.4 Detailed failure modes for some components.- 15.5 Storage reliability data [15.3].- 15.6 Failure criteria. Some examples.- 15.7 Typical costs for the screening of plastic encapsulated ICs.- 15.8 Results of 1000 h HTB life tests for CMOS microprocessors.- 15.9 Results of 1000 h HTB life tests for linear circuits.- 15.10 Average values of the failure rates for some IC families.- 15.11 Activation energy values for various technologies.- 15.12 Failures at burn-in.- References.- General Bibliography.- Reliability Glossary.- List of Abbreviations.- Polyglot Dictionary of Reliability Terms.
