Fundamentals of RF and Microwave Transistor Amplifiers

Name: Fundamentals of RF and Microwave Transistor Amplifiers
Brand: Wiley
Price: 172.99 EUR
Availability: OnlineOnly

Inder Bahl(Autor*in)

Wiley (Verlag)

Erschienen am 18. Juni 2009

696 Seiten

E-Book

PDF mit Adobe-DRM

Systemvoraussetzungen

978-0-470-46231-7 (ISBN)

172,99 €inkl. 7% MwSt.

Systemvoraussetzungen

für PDF mit Adobe-DRM

E-Book Einzellizenz

Als Download verfügbar

Beschreibung

Weitere Details

Weitere Ausgaben

Person

Inhalt

Intro
Fundamentals of RF and Microwave Transistor Amplifiers
Contents in Brief
Contents
Foreword
Preface
1. Introduction
1.1. Transistor Amplifier
1.2. Early History of Transistor Amplifiers
1.3. Benefits of Transistor Amplifiers
1.4. Transistors
1.5. Design of Amplifiers
1.6. Amplifier Manufacturing Technologies
1.7. Applications of Amplifiers
1.8. Amplifier Cost
1.9. Current Trends
1.10. Book Organization
References
2. Linear Network Analysis
2.1. Impedance Matrix
2.2. Admittance Matrix
2.3. ABCD Parameters
2.4. S-Parameters
2.4.1. S-Parameters for a One-Port Network
2.5. Relationships Between Various Two-Port Parameters
References
Problems
3. Amplifier Characteristics and Definitions
3.1. Bandwidth
3.2. Power Gain
3.3. Input and Output VSWR
3.4. Output Power
3.5. Power Added Efficiency
3.6. Intermodulation Distortion
3.6.1. IP3
3.6.2. ACPR
3.6.3. EVM
3.7. Harmonic Power
3.8. Peak-to-Average Ratio
3.9. Combiner Efficiency
3.10. Noise Characterization
3.10.1. Noise Figure
3.10.2. Noise Temperature
3.10.3. Noise Bandwidth
3.10.4. Optimum Noise Match
3.10.5. Constant Noise Figure and Gain Circles
3.10.6. Simultaneous Input and Noise Match
3.11. Dynamic Range
3.12. Multistage Amplifier Characteristics
3.12.1. Multistage IP3
3.12.2. Multistage PAE
3.12.3. Multistage NF
3.13. Gate and Drain Pushing Factors
3.14. Amplifier Temperature Coefficient
3.15. Mean Time to Failure
References
Problems
4. Transistors
4.1. Transistor Types
4.2. Silicon Bipolar Transistor
4.2.1. Figure of Merit
4.2.2. High-Frequency Noise Performance of Silicon BJT
4.2.3. Power Performance
4.3. GaAs MESFET
4.3.1. Small-Signal Equivalent Circuit
4.3.2. Figure of Merit
4.3.3. High-Frequency Noise Properties of MESFETs
4.4. Heterojunction Field Effect Transistor
4.4.1. High-Frequency Noise Properties of HEMTs
4.4.2. Indium Phosphide pHEMTs
4.5. Heterojunction Bipolar Transistors
4.5.1. High-Frequency Noise Properties of HBTs
4.5.2. SiGe Heterojunction Bipolar Transistors
4.6. MOSFET
References
Problems
5. Transistor Models
5.1. Transistor Model Types
5.1.1. Physics/Electromagnetic Theory Based Models
5.1.2. Analytical or Hybrid Models
5.1.3. Measurement Based Models
5.2. MESFET Models
5.2.1. Linear Models
5.2.2. Nonlinear Models
5.3. pHEMT Models
5.3.1. Linear Models
5.3.2. Nonlinear Models
5.4. HBT Model
5.5. MOSFET Models
5.6. BJT Models
5.7. Transistor Model Scaling
5.8. Source-Pull and Load-Pull Data
5.8.1. Theoretical Load-Pull Data
5.8.2. Measured Power and PAE Source Pull and Load Pull
5.8.3. Measured IP3 Source and Load Impedance
5.8.4. Source and Load Impedance Scaling
5.9. Temperature-Dependent Models
References
Problems
6. Matching Network Components
6.1. Impedance Matching Elements
6.2. Transmission Line Matching Elements
6.2.1. Microstrip
6.2.2. Coplanar Lines
6.3. Lumped Elements
6.3.1. Capacitors
6.3.2. Inductors
6.3.3. Resistors
6.4. Bond Wire Inductors
6.4.1. Single Wire
6.4.2. Ground Plane Effect
6.4.3. Multiple Wires
6.4.4. Maximum Current Handling of Wire
6.5. Broadband Inductors
References
Problems
7. Impedance Matching Techniques
7.1. One-Port and Two-Port Networks
7.2. Narrowband Matching Techniques
7.2.1. Lumped-Element Matching Techniques
7.2.2. Transmission Line Matching Techniques
7.3. WideBand Matching Techniques
7.3.1. Gain-Bandwidth Limitations
7.3.2. Lumped-Element Wideband Matching Techniques
7.3.3. Transmission Line Wideband Matching Networks
7.3.4. Balun-Type Wideband Matching Techniques
7.3.5. Bridged-T Matching Network
References
Problems
8. Amplifier Classes and Analyses
8.1. Classes of Amplifiers
8.2. Analysis of Class-A Amplifiers
8.3. Analysis of Class-B Amplifiers
8.3.1. Single-Ended Class-B Amplifier
8.3.2. Push-Pull Class-B Amplifier
8.3.3. Overdriven Class-B Amplifier
8.4. Analysis of Class-C Amplifiers
8.5. Analysis of Class-E Amplifiers
8.6. Analysis of Class-F Amplifiers
8.7. Comparison of Various Amplifier Classes
References
Problems
9. Amplifier Design Methods
9.1. Amplifier Design
9.1.1. Transistor Type and Fabrication Technology
9.1.2. Transistor Size Selection
9.1.3. Design Method
9.1.4. Circuit Topology
9.1.5. Circuit Analysis and Optimization
9.1.6. Stability and Thermal Analyses
9.2. Amplifier Design Techniques
9.2.1. Load-Line Method
9.2.2. Low Loss Match Design Technique
9.2.3. Nonlinear Design Method
9.2.4. Taguchi Experimental Method
9.3. Matching Networks
9.3.1. Reactive/Resistive
9.3.2. Cluster Matching Technique
9.4. Amplifier Design Examples
9.4.1. Low-Noise Amplifier Design
9.4.2. Maximum Gain Amplifier Design
9.4.3. Power Amplifier Design
9.4.4. Multistage Driver Amplifier Design
9.4.5. GaAs HBT Power Amplifer
9.5. Silicon Based Amplifier Design
9.5.1. Si IC LNA
9.5.2. Si IC Power Amplifiers
References
Problems
10. High-Efficiency Amplifier Techniques
10.1. High-Efficiency Design
10.1.1. Overdriven Amplifier Design
10.1.2. Class-B Amplifier Design
10.1.3. Class-E Amplifier Design
10.1.4. Class-F Amplifier Design
10.2. Harmonic Reaction Amplifier
10.3. Harmonic Injection Technique
10.4. Harmonic Control Amplifier
10.5. High-PAE Design Considerations
10.5.1. Harmonic Tuning Bench
10.5.2. Matching Network Loss Calculation
10.5.3. Matching Network Loss Reduction
References
Problems
11. Broadband Amplifier Techniques
11.1. Transistor Bandwidth Limitations
11.1.1. Transistor Gain Roll-off
11.1.2. Variable Device Input and Output Impedance
11.1.3. Power-Bandwidth Product
11.2. Broadband Amplifier Techniques
11.2.1. Reactive/Resistive Topology
11.2.2. Feedback Amplifiers
11.2.3. Balanced Amplifiers
11.2.4. Distributed Amplifiers
11.2.5. Active Matching Broadband Technique
11.2.6. Cascode Configuration
11.2.7. Comparison of Broadband Techniques
11.3. Broadband Power Amplifier Design Considerations
11.3.1. Topology Selection
11.3.2. Device Aspect Ratio
11.3.3. Low-Loss Matching Networks
11.3.4. Gain Flatness Technique
11.3.5. Harmonic Termination
11.3.6. Thermal Design
References
Problems
12. Linearization Techniques
12.1. Nonlinear Analysis
12.1.1. Single-Tone Analysis
12.1.2. Two-Tone Analysis
12.2. Phase Distortion
12.3. Linearization of Power Amplifiers
12.3.1. Pulsed-Doped Devices and Optimum Match
12.3.2. Predistortion Techniques
12.3.3. Feedforward Technique
12.4. Efficiency Enhancement Techniques for Linear Amplifiers
12.4.1. Chireix Outphasing
12.4.2. Doherty Amplifier
12.4.3. Envelope Elimination and Restoration
12.4.4. Bias Adaptation
12.5. Linear Amplifier Design Considerations
12.5.1. Amplifier Gain
12.5.2. Minimum Source and Load Mismatch
12.6. Linear Amplifier Design Examples
References
Problems
13. High-Voltage Power Amplifier Design
13.1. Performance Overview of High-Voltage Transistors
13.1.1. Advantages
13.1.2. Applications
13.2. High-Voltage Transistors
13.2.1. Si Bipolar Junction Transistors
13.2.2. Si LDMOS Transistors
13.2.3. GaAs FieldPlate MESFETs
13.2.4. GaAs FieldPlate pHEMTs
13.2.5. GaAs HBTs
13.2.6. SiC MESFET
13.2.7. SiC GaN HEMTs
13.3. High-Power Amplifier Design Considerations
13.3.1. Thermal Design of Active Devices
13.3.2. Power Handling of Passive Components
13.4. Power Amplifier Design Examples
13.4.1. HV Hybrid Amplifiers
13.4.2. HV Monolithic Amplifiers
13.5. Broadband HV Amplifiers
13.6. Series FET Amplifiers
References
Problems
14. Hybrid Amplifiers
14.1. Hybrid Amplifier Technologies
14.2. Printed Circuit Boards
14.3. Hybrid Integrated Circuits
14.3.1. Thin-Film MIC Technology
14.3.2. Thick-Film MIC Technology
14.3.3. Cofired Ceramic and Glass-Ceramic Technology
14.4. Design of Internally Matched Power Amplifiers
14.5. Low-Noise Amplifiers
14.5.1. Narrowband Low-Noise Amplifier
14.5.2. Ultra-wideband Low-Noise Amplifier
14.5.3. Broadband Distributed LNA
14.6. Power Amplifiers
14.6.1. Narrowband Power Amplifier
14.6.2. Broadband Power Amplifier
References
Problems
15. Monolithic Amplifiers
15.1. Advantages of Monolithic Amplifiers
15.2. Monolithic IC Technology
15.2.1. MMIC Fabrication
15.2.2. MMIC Substrates
15.2.3. MMIC Active Devices
15.2.4. MMIC Matching Elements
15.3. MMIC Design
15.3.1. CAD Tools
15.3.2. Design Procedure
15.3.3. EM Simulators
15.4. Design Examples
15.4.1. Low-Noise Amplifier
15.4.2. High-Power Limiter/LNA
15.4.3. Narrowband PA
15.4.4. Broadband PA
15.4.5. Ultra-Wideband PA
15.4.6. High-Power Amplifier
15.4.7. High-Efficiency PA
15.4.8. Millimeter-Wave PA
15.4.9. Wireless Power Amplifier Design Example
15.5. CMOS Fabrication
References
Problems
16. Thermal Design
16.1. Thermal Basics
16.2. Transistor Thermal Design
16.2.1. Cooke Model
16.2.2. Single-Gate Thermal Model
16.2.3. Multiple-Gate Thermal Model
16.3. Amplifier Thermal Design
16.4. Pulsed Operation
16.5. Heat Sink Design
16.5.1. Convectional and Forced Cooling
16.5.2. Design Example
16.6. Thermal Resistance Measurement
16.6.1. IR Image Measurement
16.6.2. Liquid Crystal Measurement
16.6.3. Electrical Measurement Technique
References
Problems
17. Stability Analysis
17.1. Even-Mode Oscillations
17.1.1. Even-Mode Stability Analysis
17.1.2. Even-Mode Oscillation Suppression Techniques
17.2. Odd-Mode Oscillations
17.2.1. Odd-Mode Stability Analysis
17.2.2. Odd-Mode Oscillation Suppression Techniques
17.2.3. Instability in Distributed Amplifiers
17.3. Parametric Oscillations
17.4. Spurious Parametric Oscillations
17.5. Low-Frequency Oscillations
References
Problems
18. Biasing Networks
18.1. Biasing of Transistors
18.1.1. Transistor Bias Point
18.1.2. Biasing Schemes
18.2. Biasing Network Design Considerations
18.2.1. Microstrip Biasing Circuit
18.2.2. Lumped-Element Biasing Circuit
18.2.3. High-PAE Biasing Circuit
18.2.4. Electromigration Current Limits
18.3. Self-Bias Technique
18.4. Biasing Multistage Amplifiers
18.5. Biasing Circuitry for Low-Frequency Stabilization
18.6. Biasing Sequence
References
Problems
19. Power Combining
19.1. Device-Level Power Combining
19.2. Circuit-Level Power Combining
19.2.1. Graceful Degradation
19.2.2. Power Combining Efficiency
19.3. Power Dividers, Hybrids, and Couplers
19.3.1. Power Dividers
19.3.2. 90° Hybrids
19.3.3. Coupled-Line Directional Couplers
19.4. N-Way Combiners
19.5. Corporate Structures
19.6. Power Handling of Isolation Resistors
19.7. Spatial Power Combiners
19.8. Comparison of Power Combining Schemes
References
Problems
20. Integrated Function Amplifiers
20.1. Integrated Limiter/LNA
20.1.1. Limiter/LNA Topology
20.1.2. Limiter Requirements
20.1.3. Schottky Diode Design and Limiter Configuration
20.1.4. 10-W Limiter/LNA Design
20.1.5. Test Data and Discussions
20.2. Transmitter Chain
20.2.1. Variable Gain Amplifier
20.2.2. Variable Power Amplifier
20.2.3. Amplifier Temperature Compensation
20.2.4. Power Monitor/Detector
20.2.5. Protection Against Load Mismatch
20.3. Cascading of Amplifiers
References
Problems
21. Amplifier Packages
21.1. Amplifier Packaging Overview
21.1.1. Brief History
21.1.2. Types of Packages
21.2. Materials for Packages
21.2.1. Ceramics
21.2.2. Polymers
21.2.3. Metals
21.3. Ceramic Package Design
21.3.1. Design of RF Feedthrough
21.3.2. Cavity Design
21.3.3. Bias Lines
21.3.4. Ceramic Package Construction
21.3.5. Ceramic Package Model
21.4. Plastic Package Design
21.4.1. Plastic Packages
21.4.2. Plastic Package Model
21.5. Package Assembly
21.5.1. Die Attach
21.5.2. Die Wire Bonding
21.5.3. Assembly of Ceramic Packages
21.5.4. Assembly of Plastic Packages
21.5.5. Hermetic Sealing and Encapsulation
21.6. Thermal Considerations
21.7. CAD Tools For Packages
21.8. Power Amplifier Modules
References
Problems
22. Transistor and Amplifier Measurements
22.1. Transistor Measurements
22.1.1. I-V Measurements
22.1.2. S-Parameter Measurements
22.1.3. Noise Parameter Measurements
22.1.4. Source-Pull and Load-Pull Measurements
22.2. Amplifier Measurements
22.2.1. Measurements Using RF Probes
22.2.2. Driver Amplifier and HPA Test
22.2.3. Large-Signal Output VSWR
22.2.4. Noise Figure Measurements
22.3. Distortion Measurements
22.3.1. AM-AM and AM-PM
22.3.2. IP3/IM3 Measurement
22.3.3. ACPR Measurement
22.3.4. NPR Measurement
22.3.5. EVM Measurement
22.4. Phase Noise Measurement
22.5. Recovery Time Measurement
References
Problems
Appendix A. Physical Constants and Other Data
Appendix B. Units and Symbols
Appendix C. Frequency Band Designations
Appendix D. Decibel Units (dB)
Appendix E. Mathematical Relationships
Appendix F. Smith Chart
Appendix G. Graphical Symbols
Appendix H. Acronyms and Abbreviations
Appendix I. List Of Symbols
Appendix J. Multiple Access and Modulation Techniques
Index

Inhalt (PDF)

Systemvoraussetzungen

Als PDF speichern Als Link merken