Metal-Semiconductor Schottky Barrier Junctions and Their Applications
Erschienen am 31. Mai 1984
Buch
Hardcover
386 Seiten
978-0-306-41521-0 (ISBN)
Beschreibung
The present-day semiconductor technology would be inconceivable without extensive use of Schottky barrier junctions. In spite of an excellent book by Professor E.H. Rhoderick (1978) dealing with the basic principles of metal- semiconductor contacts and a few recent review articles, the need for a monograph on "Metal-Semiconductor Schottky Barrier Junctions and Their Applications" has long been felt by students, researchers, and technologists. It was in this context that the idea of publishing such a monograph by Mr. Ellis H. Rosenberg, Senior Editor, Plenum Publishing Corporation, was considered very timely. Due to the numerous and varied applications of Schottky barrier junctions, the task of bringing it out, however, looked difficult in the beginning. After discussions at various levels, it was deemed appropriate to include only those typical applications which were extremely rich in R&D and still posed many challenges so that it could be brought out in the stipulated time frame. Keeping in view the larger interest, it was also considered necessary to have the different topics of Schottky barrier junctions written by experts.
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Sprache
Englisch
Verlagsort
Dordrecht
Niederlande
Verlagsgruppe
Kluwer Academic Publishers Group
Zielgruppe
Für höhere Schule und Studium
Für Beruf und Forschung
Illustrationen
38 black & white illustrations, biography
ISBN-13
978-0-306-41521-0 (9780306415210)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
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Inhalt
1. Physics of Schottky Barrier Junctions.- 1. Introduction.- 2. Origins of Barrier Height.- 2.1. Schottky-Mott Theory of Ideal Metal-Semiconductor Contact.- 2.2. Modifications to Schottky Theory.- 2.3. Classifications of Metal-Semiconductor Interfaces.- 2.4. Contacts on Reactive Interfaces.- 2.5. Contacts with Surface States and an Insulating Interfacial Layer.- 2.6. Contacts on Vacuum Cleaved Surfaces.- 3. Measurement of Barrier Height.- 3.1. Capacitance-Voltage Measurement.- 3.2. Current-Voltage Measurement.- 3.3. Photoelectric Measurement.- 4. Results of Barrier Height Measurements.- 4.1. Chemically Prepared Surfaces.- 4.2. Vacuum Cleaved Surfaces.- 4.3. Concluding Remarks.- 5. Capacitance-Voltage Characteristics.- 5.1. Electric Field and Potential Distribution in the Depletion Region.- 5.2. Depletion Region Capacitance.- 5.2.1. Ideal Schottky Barrier.- 5.2.2. Effect of Minority Carriers.- 5.2.3. Effect of Interfacial Layer.- 5.2.4. Effect of Deep Traps.- 6. Current-Voltage Characteristics.- 6.1. Transport Mechanisms.- 6.1.1. Diffusion and Thermionic Emission over the Barrier.- 6.1.2. Tunneling through the Barrier.- 6.1.3. Carrier Generation and Recombination in the Junction Depletion Region.- 6.1.4. Minority Carrier Injection.- 6.2. Forward Characteristics.- 6.3. Reverse Characteristics.- 7. Transient Behavior.- 8. Low-Resistance Schottky Barrier Contacts.- References.- 2. Interface Chemistry and Structure of Schottky Barrier Formation.- 1. Introduction.- 2. Perspectives on Schottky Barrier Formation.- 2.1. Introduction.- 2.2. Brief Review of Phenomenological Schottky Barrier Data.- 3. The Chemistry and Structure of the Interfacial Layer.- 3.1. Synopsis of the Layer-by-Layer Evolution.- 3.2. Some Techniques for Studying the Stages of Interface Formation.- 4. Evolution of the Interfacial Layer.- 4.1. Stage 0: The Clean Semiconductor Surface.- 4.1.1. Silicon (100) and (111) Surfaces.- 4.1.2. GaAs (110) and GaAs (100) Surfaces.- 4.2. Stage 1: The Dilute Limit (< 1/2 Monolayer).- 4.3. Stage 2: Monolayer Formation-Metal Film Nucleation.- 4.4. Stage 3: Additional Monolayers and Interdiffusion.- 4.5. Some Specific Characteristics of the Interfacial Layers.- 5. Formation of Interface States.- 5.1. Intrinsic Interface States Derived from the Metal and Semiconductor.- 5.2. Localized Defect and Impurity Related States.- 5.3. Interface States and the Stages of Interface Formation.- 6. Case Studies of the Chemistry and Structure of Schottky Barrier Formation.- 6.1. Case Studies of Silicon Schottky Barriers.- 6.1.1. Al, Ag, Cu, and Au Schottky Barriers.- 6.1.2. Silicide-Silicon Interfaces.- 6.2. Case Studies of III-V and II-VI Compound Semiconductor Schottky Barriers.- 6.2.1. The Ga-Al-As System.- 6.2.2. The GaAlAs Ternary System with Au Schottky Barriers.- 6.2.3. InP.- 6.2.4. Some II-VI Examples.- 7. Summary.- References.- 3. Fabrication and Characterization of Metal-Semiconductor Schottky Barrier Junctions.- 1. Introduction.- 2. Selection of Semiconductor Materials.- 3. Metal-Semiconductor Systems.- 3.1. Metal-Silicon Systems.- 3.2. Metal-GaAs Systems.- 3.3. Multilayer Metallization Systems.- 4. Design Considerations.- 5. Fabrication Technology.- 5.1. Surface Processing.- 5.2. Dielectric Film Deposition.- 5.3. Ohmic Contact Formation.- 5.4. Metal Deposition.- 5.5. Other Steps.- 6. Characterization.- References.- 4. Schottky-Barrier-Type Optoelectronic Structures.- 1. Introduction.- 2. Barrier Formation in Schottky-Barrier-Type Junctions.- 3. Transport in Schottky-Barrier-Type Structures.- 3.1. MS and MIS Structures.- 3.2. SIS Structures.- 4. Schottky-Barrier-Type Optoelectronic Structures.- 4.1. Schottky-Barrier-Type Light-Emitting Structures.- 4.2. Schottky-Barrier-Type Photodiodes.- 4.3. Schottky-Barrier-Type Photovoltaic Devices.- 4.3.1. MS and MIS Photovoltaic Devices.- 4.3.2. SIS Photovoltaic Devices.- 3. Summary.- References.- 5. Schottky Barrier Photodiodes.- 1. Introduction.- 2. General Parameters of Photodiodes.- 2.1. Signal-to-Noise Ratio (S/N).- 2.2. Noise Equivalent Power (NEP).- 2.3. Detectivity (D).- 2.4. Normalized Detectivity (D*).- 2.5. Detectivity Normalized Also with Respect to the Field of View(D**).- 2.6. Resistance Area Product.- 2.7. Response Time.- 3. Selection of Materials.- 3.1. Metal Systems.- 3.2. Semiconducting Materials.- 4. Fabrication Technology.- 5. Techniques for Evaluating Device Parameters.- 5.1. Current-Voltage Characteristics.- 5.2. Capacitance-Voltage Characteristics.- 5.3. Photoelectric Measurements.- 5.4. Electron Beam Induced Current Technique.- 6. Applications.- 7. Conclusions.- References.- 6. Microwave Schottky Barrier Diodes.- 1. Introduction.- 2. Diode Design Considerations.- 2.1. Equivalent Circuit.- 2.2. Frequency Conversion.- 2.3. Basic Mixer Diode RF Parameters.- 2.3.1. Conversion Loss Theory.- 2.3.2. Noise-Temperature Ratio.- 2.3.3. Overall Receiver Noise Figure.- 2.3.4. Mixer Noise Temperature.- 2.3.5. RF Impedance.- 2.3.6. IF Impedance.- 2.3.7. Receiver Sensitivity.- 2.3.8. Doppler Shift.- 2.3.9. Typical Doppler Radar System.- 2.4. Basic Detector RF Parameters.- 2.4.1. Video Resistance (Rv).- 2.4.2. Voltage Sensitivity.- 2.4.3. Current Sensitivity ?.- 2.4.4. Minimum Detectable Signal (MDS).- 2.4.5. Tangential Signal Sensitivity (TSS).- 2.4.6. Nominal Detectable Signal (NDS).- 2.4.7. Noise Equivalent Power (NEP).- 2.4.8. Video Bandwidth.- 2.4.9. Superheterodyne vs. Single Detection.- 2.5. Mixer Configurations.- 2.5.1. Single-Ended Mixer.- 2.5.2. Single-Balanced Mixer.- 2.5.3. Double-Balanced Mixer.- 2.5.4. Image Rejection Mixer.- 2.5.5. Image Enhanced or Image Recovery Mixer.- 3. Properties of Schottky Barrier Diodes.- 3.1. Diode Theory.- 3.2. DC Parameters.- 3.2.1. Junction Capacitance.- 3.2.2. Overlay Capacitance.- 3.2.3. Series Resistance.- 3.2.4. Figure of Merit.- 3.3. Semiconductor Materials.- 3.4. Epitaxial GaAs.- 3.5. Barrier Height Lowering.- 3.6. Fabrication.- 4. Microwave Performance.- 4.1. Mixer Diodes.- 4.2. Detector Diodes.- 5. RF Pulse and CW Burnout.- 5.1. Introduction.- 5.2. Factors Affecting RF Burnout.- 5.3. Experimental Results.- 5.4. Physical Analysis of RF Pulsed Silicon Schottky Barrier Failed Diodes.- 5.5. Physical Analysis of RF Pulsed Millimeter GaAs Schottky Barrier Failed Diodes.- 5.6. Electrostatic Failure of Silicon Schottky Barrier Diodes.- 6. Conclusions.- References.- 7. Metal-Semiconductor Field Effect Transistors.- 1. Introduction.- 2. Small-Signal FET Theory.- 3. Design Parameters of a Low-Noise Device.- 4. Practical Small-Signal FET Fabrication Techniques.- 4.1. Material Growth Techniques.- 4.2. FET Fabrication Technology.- 5. GaAs Power Field Effect Transistors.- 5.1. Principle of Power FET Operation.- 5.2. Thermal Impedance.- 5.3. Power FET Technology.- 6. Conclusions.- References.- 8. Schottky Barrier Gate Charge-Coupled Devices.- 1. Introduction.- 2. Schottky Gate CCDs.- 3. Potential-Charge Relationships.- 3.1. Surface Channel CCD.- 3.2. Bulk Channel CCD.- 3.3. Schottky Gate CCD.- 4. Charge Storage Capacity.- 4.1. Surface Channel CCD.- 4.2. Bulk Channel CCD.- 4.3. Schottky Gate CCD.- 5. Charge Transfer.- 5.1. Charge Transfer Efficiency.- 5.2. Charge Transfer Mechanisms.- 5.2.1. Surface Channel CCD.- 5.2.2. Bulk Channel CCD.- 5.2.3. Schottky Gate CCD.- 6. Input-Output Circuits.- 7. Schottky Gate Heterojunction CCDs.- 8. Experimental Results.- 8.1. High-Frequency Devices.- 8.2. Heterojunction Devices.- 9. Applications.- References.- 9. Schottky Barriers on Amorphous Si and their Applications.- 1. Introduction.- 2. Properties of Amorphous Si.- 2.1. Deposition Methods.- 2.2. Structural Properties.- 2.3. Electronic Properties.- 2.4. Surfaces.- 3. The Schottky Barrier on ?-Si:H.- 3.1. Current-Voltage Measurements.- 3.2. Capacitance Measurements.- 3.3 Internal Photoemission.- 4. Interface Kinetics and Its Effect on the Schottky Barrier.- 5. Applications.- 5.1. Drift Mobility.- 5.2. Deep Level Transient Spectroscopy.- 5.3. Solar Cells.- 5.4. Thin Film Transistors.- 6. Concluding Remarks.- References.