
Component Reliability for Electronic Systems
Artech House Publishers
Erschienen am 1. Oktober 2009
Buch
Hardcover
694 Seiten
978-1-59693-436-8 (ISBN)
Beschreibung
The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.
Weitere Details
Auflage
Unabridged edition
Sprache
Englisch
Verlagsort
Norwood
USA
Zielgruppe
Für Beruf und Forschung
Editions-Typ
Ungekürzte Ausgabe
ISBN-13
978-1-59693-436-8 (9781596934368)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
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Titu-Marius I. Bajenescu
Component Reliability for Electronic Systems
E-Book
10/2009
1. Auflage
Artech House
197,99 €
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Personen
Titu-Marius I. Bajenescu is an industry consultant at C.F.C. He holds an M.S. in electronics and telecommunications from the Polytechnica University, Bucharest, Romania. Marius I. Bazu is a senior scientific researcher at the National Institute for Research and Development in Microtechnology, IMT-Bucharest, Romania. He holds a M.S. and Ph.D. in electronics and telecommunications from the Polytechnica University, Bucharest, Romania.
Inhalt
Part I: Reliability - Reliability Building. Reliability Assessment. Package and Reliability. Failure Analysis. Test and Testability.; Part II: Reliability of Electronic Components - Reliability of Passive Electronic Parts. Reliability of Diodes. Reliability of Silicon Power Transistors. Reliability of Optoelectronic Components. Reliability of Thyristors and Triacs. Reliability of Monolithic Integrated Circuits. Reliability of Memories and Microprocessors. Reliability of Hybrid Integrated Circuits. Reliability of Micro- and Nano-Systems.