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Your search for C.P. Wong

  1. Cover: Materials for Advanced Packaging - Springer
    Daniel Lu | C.P. Wong
    Materials for Advanced Packaging
    11/2016
    2nd EDN2nd Edition
    Springer
    9783319450988 (ISBN)
    E-Book
    PDF
    Other editions
    €223.63
    Available for download
  2. Cover: Advanced Flip Chip Packaging - Springer
    Ho-Ming Tong | Yi-Shao Lai | C.P. Wong
    Advanced Flip Chip Packaging
    03/2013
    1st EDN1st Edition
    Springer
    9781441957689 (ISBN)
    E-Book
    PDF
    Other editions
    €149.79
    Available for download
  3. Cover: Nano-Bio- Electronic, Photonic and MEMS Packaging - Springer
    C.P. Wong | Kyoung-Sik Moon | Yi (Grace) Li
    Nano-Bio- Electronic, Photonic and MEMS Packaging
    12/2009
    1st EDN1st Edition
    Springer
    9781441900401 (ISBN)
    E-Book
    PDF
    Other editions
    €245.03
    Available for download
  4. Cover: Materials for Advanced Packaging - Springer
    Daniel Lu | C.P. Wong
    Materials for Advanced Packaging
    12/2008
    1st EDN1st Edition
    Springer
    9780387782195 (ISBN)
    E-Book
    PDF
    Other editions
    €171.19
    Available for download
  5. Cover: Electrical Conductive Adhesives with Nanotechnologies - Springer
    Yi (Grace) Li | Daniel Lu | C.P. Wong
    Electrical Conductive Adhesives with Nanotechnologies
    10/2009
    1st EDN1st Edition
    Springer
    9780387887838 (ISBN)
    E-Book
    PDF
    Other editions
    €171.19
    Available for download
  6. Cover: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - Springer
    Ephraim Suhir | Y.C. Lee | C.P. Wong
    Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
    Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
    05/2007
    1st EDN1st Edition
    Springer
    9780387329895 (ISBN)
    E-Book
    PDF
    Other editions
    €523.23
    Available for download
  7. Cover: Materials for Advanced Packaging - Springer
    Daniel Lu | C.P. Wong
    Materials for Advanced Packaging
    12/2008
    Springer
    9780387782188 (ISBN)
    Book
    Hardback
    Other editions
    €213.99
    Shipment within 5-7 days
    New edition available
  8. Cover: Materials for Advanced Packaging - Springer
    Daniel Lu | C.P. Wong
    Materials for Advanced Packaging
    12/2016
    2nd EDN2nd Edition
    Springer
    9783319450971 (ISBN)
    Book
    Hardback
    Other editions
    €320.99
    Shipment within 10-15 days
  9. Cover: Materials for Advanced Packaging - Springer
    Daniel Lu | C.P. Wong
    Materials for Advanced Packaging
    06/2018
    2nd EDN2nd Edition
    Springer
    9783319832098 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €235.39
    Shipment within 10-15 days
  10. Cover: Electronics Manufacturing - McGraw-Hill Professional
    John Lau | C.P. Wong | Ning-Cheng Lee
    Electronics Manufacturing
    with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
    09/2002
    McGraw-Hill Professional
    9780071386241 (ISBN)
    Book
    Hardback
    €144.78
    Article not available at the moment
  11. Cover: Electrical Conductive Adhesives with Nanotechnologies - Springer
    Yi (Grace) Li | Daniel Lu | C.P. Wong
    Electrical Conductive Adhesives with Nanotechnologies
    10/2009
    Springer
    9780387887821 (ISBN)
    Book
    Hardback
    Other editions
    €181.89
    Shipment within 7-9 days
  12. Cover: Advanced Flip Chip Packaging - Springer
    Ho-Ming Tong | Yi-Shao Lai | C.P. Wong
    Advanced Flip Chip Packaging
    08/2016
    Springer
    9781489979339 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €159.99
    Shipment within 15-20 days
  13. Cover: Materials for Advanced Packaging - Springer
    Daniel Lu | C.P. Wong
    Materials for Advanced Packaging
    11/2010
    Springer
    9781441946119 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €139.09
    Exhausted; check for reprint
    New edition available
  14. Cover: Electrical Conductive Adhesives with Nanotechnologies - Springer
    Yi (Grace) Li | Daniel Lu | C.P. Wong
    Electrical Conductive Adhesives with Nanotechnologies
    09/2014
    Springer
    9781489983077 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €181.89
    Shipment within 15-20 days
  15. Cover: Nano-Bio- Electronic, Photonic and MEMS Packaging - Springer
    C.P. Wong | Kyoung-Sik Moon | Yi (Grace) Li
    Nano-Bio- Electronic, Photonic and MEMS Packaging
    09/2014
    Springer
    9781489983619 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €249.98
    Shipment within 15-20 days
  16. Cover: Advanced Flip Chip Packaging - Springer
    Ho-Ming Tong | Yi-Shao Lai | C.P. Wong
    Advanced Flip Chip Packaging
    03/2013
    Springer
    9781441957672 (ISBN)
    Book
    Hardback
    Other editions
    €213.99
    Shipment within 15-20 days
  17. Cover: Nano-Bio- Electronic, Photonic and MEMS Packaging - Springer
    C.P. Wong | Kyoung-Sik Moon | Yi (Grace) Li
    Nano-Bio- Electronic, Photonic and MEMS Packaging
    12/2009
    Springer
    9781441900395 (ISBN)
    Book
    Hardback
    Other editions
    €267.49
    Exhausted; check for reprint
    New edition available
  18. Cover: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - Springer
    Ephraim Suhir | Y.C. Lee | C.P. Wong
    Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
    Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
    08/2016
    Springer
    9781489978851 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €599.98
    Exhausted; check different version
  19. Cover: Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging - Springer
    Ephraim Suhir | Y.C. Lee | C.P. Wong
    Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
    Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
    10/2006
    Springer
    9780387279749 (ISBN)
    Book
    Hardback
    Other editions
    €534.99
    Exhausted; check different version
  20. This image is currently not available.
    John H. Lau | Wataru Nakayama | John Prince
    Electronic Packaging
    Design, Materials, Process, and Reliability
    02/1998
    McGraw-Hill Inc.,US
    9780070371354 (ISBN)
    Book
    Hardback
    €53.22
    Article not available