
Materials for Advanced Packaging
Published on 4. November 2010
Book
Paperback/Softback
XII, 724 pages
978-1-4419-4611-9 (ISBN)
Article exhausted; check for reprint
Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
More details
Edition
Softcover reprint of hardcover 1st ed. 2009
Language
English
Place of publication
NY
United States
Target group
Professional and scholarly
Professional/practitioner
Product notice
Paperback (trade)
Illustrations
300
15 s/w Tabellen, 300 s/w Abbildungen
300 black & white illustrations, 15 black & white tables, biography
Dimensions
Height: 23.5 cm
Width: 15.5 cm
Thickness: 37 mm
Weight
1104 gr
ISBN-13
978-1-4419-4611-9 (9781441946119)
DOI
10.1007/978-0-387-78219-5
Schweitzer Classification
Other editions
New editions

Daniel Lu | C.P. Wong
Materials for Advanced Packaging
Book
12/2016
2nd Edition
Springer
€320.99
Shipment within 10-15 days
Additional editions

Daniel Lu | C.P. Wong
Materials for Advanced Packaging
Book
12/2008
Springer
€213.99
Shipment within 5-7 days
Content
3D Integration Technologies - An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.