Materials for Advanced Packaging
Published on 4. November 2010
Book
Paperback/Softback
XII, 724 pages
978-1-4419-4611-9 (ISBN)
Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
More details
Edition
Softcover reprint of hardcover 1st ed. 2009
Language
English
Place of publication
NY
United States
Target group
Professional and scholarly
Professional/practitioner
Product notice
Paperback (trade)
Illustrations
300
15 s/w Tabellen, 300 s/w Abbildungen
300 black & white illustrations, 15 black & white tables, biography
Dimensions
Height: 23.5 cm
Width: 15.5 cm
Thickness: 37 mm
Weight
1104 gr
ISBN-13
978-1-4419-4611-9 (9781441946119)
DOI
10.1007/978-0-387-78219-5
Schweitzer Classification
Other editions
New editions
Daniel Lu | C.P. Wong
Materials for Advanced Packaging
Book
12/2016
2nd Edition
Springer
€320.99
Shipment within 10-15 days
Additional editions
Daniel Lu | C.P. Wong
Materials for Advanced Packaging
Book
12/2008
Springer
€213.99
Shipment within 5-7 days
Content
3D Integration Technologies - An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.