Materials for Advanced Packaging
Published on 10. December 2008
Book
Hardback
XII, 724 pages
978-0-387-78218-8 (ISBN)
Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
More details
Edition
2009 ed.
Language
English
Place of publication
New York
United States
Target group
Adult education
Professional/practitioner
Illustrations
300 s/w Abbildungen
XII, 724 p. 300 illus.
Dimensions
Height: 23.5 cm
Width: 15.5 cm
Weight
1256 gr
ISBN-13
978-0-387-78218-8 (9780387782188)
DOI
10.1007/978-0-387-78219-5
Schweitzer Classification
Other editions
New editions
Daniel Lu | C.P. Wong
Materials for Advanced Packaging
Book
12/2016
2nd Edition
Springer
€320.99
Shipment within 10-15 days
Additional editions
Daniel Lu | C.P. Wong
Materials for Advanced Packaging
Book
11/2010
Springer
€139.09
Article exhausted; check for reprint
Daniel Lu | C.P. Wong
Materials for Advanced Packaging
E-Book
12/2008
1st Edition
Springer
€171.19
Available for download
Content
3D Integration Technologies - An Overview.- Advanced Bonding/Joining Techniques.- Advanced Chip-to-Substrate Connections.- Advanced Wire Bonding Technology: Materials, Methods, and Testing.- Lead-Free Soldering.- Thin Die Production.- Advanced Substrates: A Materials and Processing Perspective.- Advanced Print Circuit Board Materials.- Flip-Chip Underfill: Materials, Process and Reliability.- Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips.- Electrically Conductive Adhesives (ECAs).- Die Attach Adhesives and Films.- Thermal Interface Materials.- Embedded Passives.- Nanomaterials and Nanopackaging.- Wafer Level Chip Scale Packaging.- Microelectromechanical Systems and Packaging.- LED and Optical Device Packaging and Materials.- Digital Health and Bio-Medical Packaging.