Embedded Mechatronic Systems
Analysis of Failures, Predictive Reliability
2nd Edition
Published on 15. November 2019
Book
Hardback
274 pages
978-1-78548-189-5 (ISBN)
Description
Mechatronics brings together computer science, mechanics and electronics. It enables us to improve the performances of embedded electronic systems by reducing their weight, volume, energy consumption and cost. Mechatronic equipment must operate without failure throughout ever-increasing service lives.The particularly severe conditions of use of embedded mechatronics cause failure mechanisms which are the source of breakdowns. Until now, these failure phenomena have not been looked at with enough depth to be able to be controlled.
More details
Edition
2nd edition
Language
English
Place of publication
United Kingdom
Target group
Professional and scholarly
Product notice
Laminated cover
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 16 mm
Weight
537 gr
ISBN-13
978-1-78548-189-5 (9781785481895)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Abdelkhalak El Hami | Philippe Pougnet
Embedded Mechatronic Systems
Analysis of Failures, Predictive Reliability
E-Book
11/2019
2nd Edition
Elsevier
€92.95
Available for download
Previous edition
Abdelkhalak El Hami | Philippe Pougnet
Embedded Mechatronic Systems, Volume 1
Analysis of Failures, Predictive Reliability
Book
07/2015
ISTE Press - Elsevier
€133.70
Article exhausted; check for reprint
Persons
Abdelkhalak El Hami is Professeur des universites at the Institut National des Sciences Appliquees (INSA-Rouen) in France and is in charge of the Normandy Conservatoire National des Arts et Metiers (CNAM) Chair of Mechanics and Head of the department of mechanical engineering of INSA Normandy, as well as several European pedagogical projects. He is an expert in fluid-structure interaction studies, reliability and optimization.
Content
1. Reliability-Based Design Optimization
2. Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices
3. Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities
4. Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques
5. Characterization of Switching Transistors under Electrical Overvoltage Stresses
6. Reliability OF Radio Frequency Power Transistors to Electromagnetic and Thermal Stress
7. Internal Temperature Measurement of Electronic Components
8. Reliability Prediction of Embedded Electronic Systems: the FIDES Guide
9. Study of the Dynamic Contact Between Deformable Solids
2. Non-Destructive Characterization by Spectroscopic Ellipsometry of Interfaces in Mechatronic Devices
3. Method of Characterizing the Electromagnetic Environment in Hyperfrequency Circuits Encapsulated within Metallic Cavities
4. Metrology of Static and Dynamic Displacements and Deformations Using Full-Field Techniques
5. Characterization of Switching Transistors under Electrical Overvoltage Stresses
6. Reliability OF Radio Frequency Power Transistors to Electromagnetic and Thermal Stress
7. Internal Temperature Measurement of Electronic Components
8. Reliability Prediction of Embedded Electronic Systems: the FIDES Guide
9. Study of the Dynamic Contact Between Deformable Solids