
Diffusion Processes in High Technology Materials
Trans Tech Publications Ltd (Publisher)
Published on 1. January 1991
Software
Digital media
290 pages
978-3-03859-607-3 (ISBN)
Description
Defect and Diffusion Forum Vol. 59
More details
Language
English
Place of publication
Switzerland
Publishing group
Trans Tech Publications
Target group
Professional and scholarly
Dimensions
Height: 142 mm
Width: 125 mm
Thickness: 10 mm
Weight
200 gr
ISBN-13
978-3-03859-607-3 (9783038596073)
DOI
10.4028/www.scientific.net/DDF.59
Schweitzer Classification
Other editions
Additional editions

D. Gupta | A.D. Romig | M.A. Dayananda
Diffusion Processes in High Technology Materials
Book
01/1991
Trans Tech Publications Ltd
€185.70
Article exhausted; check different version

D. Gupta | A.D. Romig | M.A. Dayananda
Diffusion Processes in High Technology Materials
E-Book
01/1988
Trans Tech Publications Ltd
€182.97
Available for download
Content
Point Defects and Diffusion in Silicon and Gallium ArsenideDiffusion and Low Temperature Deformation by Diffusional Creep of Nanocrystalline MaterialsDopant and Ion Beam Enhanced Grain Growth in Polycrystalline Silicon FilmsInterface Segregation and CohesionOxidation of High Technology MaterialsInterstitial-Substitutional Diffusion in Group III-V and Group IV Semiconductors: The Role of DislocationsDiffusion Barriers - For Thin Film MetallizationsContact Metallization for GaAs - A Report on the Development of a Non-Alloyed Ohmic Contact SchemeHigh Density Interconnect for Advanced VLSI PackagingDiffusion in Metallic Thin FilmsHigh Resolution Transmission Electron Microscopy of Grain BoundariesTunneling Microscopy of Surface DiffusionCharacterization of Interfacial Chemistry by Analytical Electron MicroscopySolute Interactions in MetalsOxygen Diffusion in High Tc-SuperconductorsTracer Diffusion of 60Co and 63Ni in Amorphous NiZr AlloyTracer Diffusion in Pure and Boron-Doped Ni3AlThe Behavior of Transition Metals in Silicon during Annealing TransientsSuppression of Vacancy Diffusion during Short Range OrderingCrystallization and Diffusion Studies in Amorphous Ni-Zr Thin FilmsCompound Formation and Interfacial Instability in the Au-Cu-Sn System at Low Temperature