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Your search for Xing-Chang Wei

  1. Cover: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging - CRC Press
    Xing-Chang Wei
    Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
    09/2017
    CRC Press
    9781315305868 (ISBN)
    E-Book
    PDF
    Other editions
    €63.49
    Available for download
  2. Cover: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging - CRC Press
    Xing-Chang Wei
    Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
    09/2017
    CRC Press
    9781315305851 (ISBN)
    E-Book
    ePUB
    Other editions
    €63.49
    Available for download
  3. Cover: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging - CRC Press
    Xing-Chang Wei
    Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
    05/2017
    1st EDN1st Edition
    CRC Press
    9781138033566 (ISBN)
    Book
    Hardback
    Other editions
    €215.41
    Article not available at the moment
  4. Cover: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging - CRC Press
    Xing-Chang Wei
    Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
    06/2020
    1st EDN1st Edition
    CRC Press
    9780367573669 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €70.00
    Shipment within 15-20 days