Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Published on 19. September 2017
340 pages
978-1-315-30586-8 (ISBN)
Description
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.
This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
More details
Language
English
Place of publication
London
United Kingdom
Publishing group
Taylor & Francis Ltd
Target group
College/higher education
Illustrations
261 s/w Abbildungen, 10 s/w Tabellen, 123 s/w Photographien bzw. Rasterbilder, 138 s/w Zeichnungen
10 Tables, black and white; 138 Line drawings, black and white; 123 Halftones, black and white; 261 Illustrations, black and white
File size
12,82 MB
ISBN-13
978-1-315-30586-8 (9781315305868)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Book
06/2020
1st Edition
CRC Press
€70.00
Shipment within 15-20 days
Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Book
05/2017
1st Edition
CRC Press
€215.41
Article not available at the moment
Person
Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xi'an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institute of Engineers Prestigious Engineering Achievement Award for his contribution to the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China's Ministry of Education.
His main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.
His main research interests include power integrity and signal integrity simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experience in the EMC modeling and design of high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area.
Content
Introduction. Modal Fields of Power/Ground Planes and Grids. Integral Equation Solutions of Power Distribution Network. Via Modeling. PCB-Level EMC Controls and Designs. Interposer EMC Design. Applications of New Structures and Materials.
