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Your search for Seonho Seok

  1. Cover: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering - Springer
    Seonho Seok
    Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
    Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
    04/2018
    1st EDN1st Edition
    Springer
    9783319778723 (ISBN)
    E-Book
    PDF
    Other editions
    €139.09
    Available for download
  2. Cover: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering - Springer
    Seonho Seok
    Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
    Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
    05/2018
    Springer
    9783319778716 (ISBN)
    Book
    Hardback
    Other editions
    €149.79
    Shipment within 10-15 days
  3. Cover: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering - Springer
    Seonho Seok
    Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
    Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
    01/2019
    Springer
    9783030085612 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €149.79
    Shipment within 7-9 days
  4. Cover: MEMS Packaging Technologies and 3D Integration - MDPI AG
    MEMS Packaging Technologies and 3D Integration
    06/2022
    MDPI AG
    9783036542584 (ISBN)
    Book
    Hardback
    €83.20
    Shipment within 15-20 days