MEMS Packaging Technologies and 3D Integration
MDPI AG (Publisher)
Published on 1. June 2022
Book
Hardback
210 pages
978-3-0365-4258-4 (ISBN)
Description
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
More details
Language
English
Product notice
sewn/stitched
Cloth over boards
Dimensions
Height: 250 mm
Width: 175 mm
Thickness: 18 mm
Weight
725 gr
ISBN-13
978-3-0365-4258-4 (9783036542584)
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Schweitzer Classification