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Your search for John Lau

  1. Cover: Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration - Springer
    John Lau | Kuo-Ning Chiang
    Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
    05/2026
    Springer
    9789819568918 (ISBN)
    E-Book
    PDF
    Other editions
    €213.99
    Available for download
  2. Cover: Basics Fashion Design 09: Designing Accessories - Bloomsbury Visual Arts
    John Lau
    Basics Fashion Design 09: Designing Accessories
    Exploring the Design and Construction of Bags, Shoes, Hats and Jewellery
    01/2021
    1st EDN1st Edition
    Bloomsbury Visual Arts
    9781350241442 (ISBN)
    E-Book
    ePUB
    Other editions
    €29.99
    Available for download
  3. Cover: Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration - Springer
    John Lau | Xuejun Fan
    Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
    05/2025
    1st EDN1st Edition
    Springer
    9789819641666 (ISBN)
    E-Book
    PDF
    Other editions
    €181.89
    Available for download
  4. Cover: Thermal Stress and Strain in Microelectronics Packaging - Springer
    John Lau
    Thermal Stress and Strain in Microelectronics Packaging
    12/2012
    Springer
    9781468477672 (ISBN)
    E-Book
    PDF
    Other editions
    €149.79
    Available for download
  5. Cover: Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration - Springer
    John Lau | Kuo-Ning Chiang
    Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
    approx. 06/2026
    Springer
    9789819568901 (ISBN)
    Book
    Hardback
    Other editions
    €213.99
    Not yet published
  6. Cover: Microvias: For Low Cost, High Density Interconnects - McGraw-Hill Education
    John Lau | Ricky Lee
    Microvias: For Low Cost, High Density Interconnects
    05/2001
    1st EDN1st Edition
    McGraw-Hill Education
    9780071382991 (ISBN)
    E-Book
    PDF
    Other editions
    €129.53
    Available for download
  7. Cover: Basics Fashion Design 09: Designing Accessories - AVA Publishing
    John Lau
    Basics Fashion Design 09: Designing Accessories
    Exploring the Design and Construction of Bags, Shoes, Hats and Jewellery
    10/2012
    1st EDN1st Edition
    AVA Publishing
    9782940439720 (ISBN)
    E-Book
    PDF
    Other editions
    €29.99
    Available for download
  8. Cover: Advanced MEMS Packaging - McGraw-Hill Professional
    John Lau | Cheng Lee | C. Premachandran
    Advanced MEMS Packaging
    12/2009
    McGraw-Hill Professional
    9780071626231 (ISBN)
    Book
    Hardback
    Other editions
    €144.83
    Article not available at the moment
  9. Cover: Diseño de accesorios - Editorial Gg
    John Lau
    Diseño de accesorios
    11/2013
    Editorial Gg
    9788425226434 (ISBN)
    E-Book
    PDF
    €19.99
    Available for download
  10. Cover: Electronics Manufacturing - McGraw-Hill Professional
    John Lau | C.P. Wong | Ning-Cheng Lee
    Electronics Manufacturing
    with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
    09/2002
    McGraw-Hill Professional
    9780071386241 (ISBN)
    Book
    Hardback
    €144.78
    Article not available at the moment
  11. Cover: Nihil - Unicorn Publishing Group
    Joshua Hagler
    Nihil
    Joshua Hagler in New Mexico
    07/2025
    Unicorn Publishing Group
    9781917458016 (ISBN)
    Book
    Hardback
    €37.50
    Shipment within 3-4 weeks
  12. Cover: Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration - Springer Nature Switzerland AG
    John Lau | Xuejun Fan
    Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
    05/2025
    Springer Nature Switzerland AG
    9789819641659 (ISBN)
    Book
    Hardback
    Other editions
    €192.59
    Shipment within 3-4 weeks
  13. Cover: 3D IC Integration and Packaging - McGraw-Hill Professional
    John Lau
    3D IC Integration and Packaging
    10/2015
    McGraw-Hill Professional
    9780071848060 (ISBN)
    Book
    Hardback
    €198.50
    Shipment within 15-20 days
  14. Cover: Thermal Stress and Strain in Microelectronics Packaging - Springer
    John Lau
    Thermal Stress and Strain in Microelectronics Packaging
    04/2012
    Springer
    9781468477696 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €160.49
    Shipment within 15-20 days
  15. Cover: Basics Fashion Design 09: Designing Accessories - Bloomsbury Visual Arts
    John Lau
    Basics Fashion Design 09: Designing Accessories
    Exploring the design and construction of bags, shoes, hats and jewellery
    01/2019
    Bloomsbury Visual Arts
    9781350108851 (ISBN)
    Book
    Paperback/Softback
    Other editions
    €35.00
    Shipment within 15-20 days
  16. Cover: Through-Silicon Vias for 3D Integration - McGraw-Hill Professional
    John Lau
    Through-Silicon Vias for 3D Integration
    12/2012
    McGraw-Hill Professional
    9780071785143 (ISBN)
    Book
    Hardback
    €172.50
    Shipment within 15-20 days
  17. Cover: Frank and the Bad Surprise - Recorded Books, Inc.
    Martha Brockenbrough | Christopher Gebauer
    Frank and the Bad Surprise
    04/2022
    Recorded Books, Inc.
    9798212008365 (ISBN)
    Audio
    CD-Audio
    €56.78
    Shipment within 10-20 days
  18. Cover: Reliability of RoHS-Compliant 2D and 3D IC Interconnects - McGraw-Hill Professional
    John Lau
    Reliability of RoHS-Compliant 2D and 3D IC Interconnects
    12/2010
    McGraw-Hill Professional
    9780071753791 (ISBN)
    Book
    Hardback
    €134.50
    Shipment within 15-20 days
  19. Cover: Advanced Copper-Gold Wire-Stud Interconnection Technologies - McGraw-Hill Professional
    John Lau | Hong Meng Ho
    Advanced Copper-Gold Wire-Stud Interconnection Technologies
    08/2012
    McGraw-Hill Professional
    9780071785167 (ISBN)
    Book
    Hardback
    €129.98
    The article will not be published
  20. Cover: Microvias: For Low Cost, High Density Interconnects - McGraw-Hill Professional
    John Lau | Ricky Lee
    Microvias: For Low Cost, High Density Interconnects
    06/2001
    McGraw-Hill Professional
    9780071363273 (ISBN)
    Book
    Hardback
    Other editions
    €74.27
    Exhausted; check different version
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