Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration
Description
This book focuses on the design, materials, process, fabrication, quality, reliability, fatigue, fracture, and artificial intelligence (AI) assisted in chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more emphasis placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as Cu interconnects, glass-core substrate, 3D heterogeneous integration of photonic IC and electronic IC, and combining simulation design with AI technology to effectively apply it to semiconductor packaging.
This book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
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Persons
John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 530 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 24 textbooks. John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.
Professor K.N. Chiang received his Ph.D. from the Georgia Institute of Technology in the United States. He is the chair professor at the National Tsing Hua University in Hsinchu, Taiwan. After graduating from Georgia Tech, he worked for four years as a senior researcher at MSC/NASTRAN, a world-famous finite element system. From 2010 to 2013, he served as a general director of the National High-Performance Computing Center, which is the National Strategic Research Center of Taiwan. He has received outstanding research awards from the Ministry of Science and Technology of Taiwan three times and has published more than 450 technical papers in international journals and conference proceedings. He has been granted more than 50 invention patents. Among the major awards Professor Chiang received are the Excellence in Mechanics Award from ASME-EPPD (2022) and the Outstanding Sustained Technical Contribution Award (2020) from IEEE-EPS.
Content
Advanced Packaging.- Cu Hybrid Bonding.- Glass Packaging.- CoPackaged Optics (CPO).- Characterization of Low Loss Dielectric Materials for Speed and Frequency Applications.- Fatigue and Fracture Models for Electronic Packaging.- AI and Machine Learning Algorithms.- Modeling and Design Simulation Technology.- Integrating AI with Design Simulation for Advanced Packaging.