Advanced Engineering Materials: Properties and Processing Technologies
Published on 25. May 2023
152 pages
978-3-0364-1328-0 (ISBN)
Description
This special edition contains a series of articles on research results in areas of structural metal materials, and materials for applications in opto- and microelectronics and power electronic devices based on silicon carbide. The presented edition will be helpful to many specialists whose activity is related to machinery and the electronic industry.
This special edition contains a series of articles on research results in areas of structural metal materials, and materials for applications in opto- and microelectronics and power electronic devices based on silicon carbide. The presented edition will be helpful to many specialists whose activity is related to machinery and the electronic industry.
More details
Series
Language
English
Place of publication
Zurich
Switzerland
Target group
Professional and scholarly
Illustrations
Illustrations, unspecified
File size
30,29 MB
ISBN-13
978-3-0364-1328-0 (9783036413280)
DOI
10.4028/b-sEH9N7
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions
Hock Jin Quah | Juraj Marek | Gregor Pobegen
Advanced Engineering Materials: Properties and Processing Technologies
Book
06/2023
Trans Tech Publications Ltd
€136.18
Shipment within 10-20 days
Content
<ul><li>Preface</li><li>Chapter 1: Properties and Processing Technologies of Structural Metals</li><li>Influence of Tool Eccentricity pin Positioning on AA6061 Aluminium Alloy Friction Stir Welds</li><li>Cylindrical Billet Size Optimization for Hot Closed-Die Forging of the Upper Ball Joint</li><li>Effect of Melting Temperature and Flux on Slag Percentage in Die Casting Process of Zamak3 Alloy</li><li>Roughness Test of Aluminum A5052 before and after Forming by SPIF Process</li><li>Modelling of Creep Rupture in Grade 92 Steel Using a Microstructure-Type Finite Element Mesh</li><li>Ag Powder Production Using Wire Arc Spray Technique</li><li>Chapter 2: Optical and Electronic Materials</li><li>Using the Rods as Collector and Study of its Effect on Morphology and Uniformity of Nanofibers via Electrospinning</li><li>Rapid Thermal Annealing Process Toward Enhancement of ITO Thin Films</li><li>Fabrication of PS/Al Nanocomposites as Foils and Evaluation of their Optical Properties</li><li>Nearly Zero Ultra-Flattened Dispersion in Octagonal Photonic Crystal Fiber</li><li>Impacts of Wafer Doping Type on Structural and Optical Properties of Black Silicon Fabricated by Metal-Assisted Chemical Etching</li><li>Ray Tracing of Perovskite Thin Films for Solar Windows</li><li>Study of Porous III-V Surface Structure via Etching Process: Effect of Pore Depth</li><li>Chapter 3: Research and Optimisation Devices Based on Silicon Carbide</li><li>A Fully Self-Aligned SiC Trench MOSFET with 0.5 ?m Channel Pitch</li><li>Highly Efficient Floating Field Rings for SiC Power Electronic Devices - A Systematic Experimental Study</li><li>Fabrication of an Open Gate-4H-SiC Junction Field Effect Transistor for Bio-Related and Chemical Sensing Applications</li><li>Tailoring the Charge Carrier Lifetime Distribution of 10 kV SiC PiN Diodes by Physical Simulations</li><li>10kV+ Rated SiC n-IGBTs: Novel Collector-Side Design Approach Breaking the Trade-Off between dV/dt and Device Efficiency</li><li>A Scalable SPICE Electrothermal Compact Model for SiC MOSFETs: A Comparative Study between the LEVEL-3 and the BSIM</li></ul>
