Advanced Engineering Materials: Properties and Processing Technologies

<ul><li>Preface</li><li>Chapter 1: Properties and Processing Technologies of Structural Metals</li><li>Influence of Tool Eccentricity pin Positioning on AA6061 Aluminium Alloy Friction Stir Welds</li><li>Cylindrical Billet Size Optimization for Hot Closed-Die Forging of the Upper Ball Joint</li><li>Effect of Melting Temperature and Flux on Slag Percentage in Die Casting Process of Zamak3 Alloy</li><li>Roughness Test of Aluminum A5052 before and after Forming by SPIF Process</li><li>Modelling of Creep Rupture in Grade 92 Steel Using a Microstructure-Type Finite Element Mesh</li><li>Ag Powder Production Using Wire Arc Spray Technique</li><li>Chapter 2: Optical and Electronic Materials</li><li>Using the Rods as Collector and Study of its Effect on Morphology and Uniformity of Nanofibers via Electrospinning</li><li>Rapid Thermal Annealing Process Toward Enhancement of ITO Thin Films</li><li>Fabrication of PS/Al Nanocomposites as Foils and Evaluation of their Optical Properties</li><li>Nearly Zero Ultra-Flattened Dispersion in Octagonal Photonic Crystal Fiber</li><li>Impacts of Wafer Doping Type on Structural and Optical Properties of Black Silicon Fabricated by Metal-Assisted Chemical Etching</li><li>Ray Tracing of Perovskite Thin Films for Solar Windows</li><li>Study of Porous III-V Surface Structure via Etching Process: Effect of Pore Depth</li><li>Chapter 3: Research and Optimisation Devices Based on Silicon Carbide</li><li>A Fully Self-Aligned SiC Trench MOSFET with 0.5 ?m Channel Pitch</li><li>Highly Efficient Floating Field Rings for SiC Power Electronic Devices - A Systematic Experimental Study</li><li>Fabrication of an Open Gate-4H-SiC Junction Field Effect Transistor for Bio-Related and Chemical Sensing Applications</li><li>Tailoring the Charge Carrier Lifetime Distribution of 10 kV SiC PiN Diodes by Physical Simulations</li><li>10kV+ Rated SiC n-IGBTs: Novel Collector-Side Design Approach Breaking the Trade-Off between dV/dt and Device Efficiency</li><li>A Scalable SPICE Electrothermal Compact Model for SiC MOSFETs: A Comparative Study between the LEVEL-3 and the BSIM</li></ul>