RF and Microwave Microelectronics Packaging
1st Edition
Published on 1. December 2009
XVI, 285 pages
978-1-4419-0984-8 (ISBN)
Description
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
More details
Other editions
Additional editions
Ken Kuang | Franklin Kim | Sean S. Cahill
RF and Microwave Microelectronics Packaging
Book
09/2014
Springer
€160.49
Shipment within 15-20 days
Ken Kuang | Franklin Kim | Sean S. Cahill
RF and Microwave Microelectronics Packaging
Book
11/2009
Springer
€160.49
Shipment within 15-20 days
Content
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.
