RF and Microwave Microelectronics Packaging
Published on 17. November 2009
Book
Hardback
XVI, 285 pages
978-1-4419-0983-1 (ISBN)
Description
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
More details
Edition
2010 ed.
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Professional/practitioner
Product notice
sewn/stitched
Cloth over boards
Illustrations
XVI, 285 p.
Dimensions
Height: 243 mm
Width: 164 mm
Thickness: 34 mm
Weight
635 gr
ISBN-13
978-1-4419-0983-1 (9781441909831)
DOI
10.1007/978-1-4419-0984-8
Schweitzer Classification
Other editions
Additional editions
Ken Kuang | Franklin Kim | Sean S. Cahill
RF and Microwave Microelectronics Packaging
Book
09/2014
Springer
€160.49
Shipment within 15-20 days
Ken Kuang | Franklin Kim | Sean S. Cahill
RF and Microwave Microelectronics Packaging
E-Book
12/2009
1st Edition
Springer
€149.79
Available for download
Content
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.