Silicon VLSI Technology
Fundamentals, Practice, and Modeling
Published on 25. July 2000
Book
Paperback/Softback
832 pages
978-0-13-085037-9 (ISBN)
Description
Unique in approach, this book provides an integrated view of silicon technology--with an emphasis on modern computer simulation. It describes not only the manufacturing practice associated with the technologies used in silicon chip fabrication, but also the underlying scientific basis for those technologies. KEY TOPICS: Modern CMOS Technology. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers. Semiconductor Manufacturing--Clean Rooms, Wafer Cleaning and Gettering. Lithography. Thermal Oxidation and the Si/SiO 2 Interface. Dopant Diffusion. Ion Implantation. Thin Film Diffusion. Etching. Backend Technology. MARKET: For anyone interested in Fabrication Processes.
More details
Language
English
Place of publication
United States
Publishing group
Pearson Education (US)
Target group
College/higher education
Dimensions
Height: 239 mm
Width: 193 mm
Thickness: 36 mm
Weight
1460 gr
ISBN-13
978-0-13-085037-9 (9780130850379)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
New editions
James D. Plummer | Michael Deal | Peter D. Griffin
Silicon VLSI Technology
Book
02/2021
2nd Edition
Pearson
€113.37
Article is exhausted; no reprint
Previous edition
James D. Plummer | Michael Deal | Peter D. Griffin
Silicon VLSI Technology
Fundamentals, Practice, and Modeling: International Edition
Book
07/2000
Pearson
€175.21
Article exhausted; check for reprint
Content
(NOTE: Chapters 3-11 include an Introduction, Historical Development and Basic Concepts, Manufacturing Methods and Equipment, Measurement Methods, Models and Simulation, Limits and Future Trends in Technologies and Models, Summary of Key Ideas, References, and Problems.)
1. Introduction and Historical Perspective.
Introduction. Integrated Circuits and the Planar Process-Key Inventions That Made It All Possible. Semiconductors. Semiconductor Devices. Semiconductor Circuit Families. Modern Scientific Discovery-Experiments, Theory and Computer Simulation. The Plan for This Book.
2. Modern CMOS Technology.
CMOS Process Flow.
3. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers.
4. Semiconductor Manufacturing- Clean Rooms, Wafer Cleaning and Gettering.
5. Lithography.
6. Thermal Oxidation and the Si/SiO2 Interface.
7. Dopant Diffusion.
8. Ion Implantation.
9. Thin Film Deposition.
10. Etching.
11. Backend Technology.
1. Introduction and Historical Perspective.
Introduction. Integrated Circuits and the Planar Process-Key Inventions That Made It All Possible. Semiconductors. Semiconductor Devices. Semiconductor Circuit Families. Modern Scientific Discovery-Experiments, Theory and Computer Simulation. The Plan for This Book.
2. Modern CMOS Technology.
CMOS Process Flow.
3. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers.
4. Semiconductor Manufacturing- Clean Rooms, Wafer Cleaning and Gettering.
5. Lithography.
6. Thermal Oxidation and the Si/SiO2 Interface.
7. Dopant Diffusion.
8. Ion Implantation.
9. Thin Film Deposition.
10. Etching.
11. Backend Technology.