
Doping Engineering for Front-End Processing: Volume 1070
Materials Research Society (Publisher)
Published on 17. October 2008
Book
Hardback
336 pages
978-1-60511-040-0 (ISBN)
Description
Materials scientists, silicon technologists and TCAD researchers come together in this book to share experimental results and physical models, discuss achievements and challenges, and identify key issues for future research in this field. The volume focuses on many aspects related to doping of semiconductors (Si, SiGe and Ge) for device fabrication, and explores areas for single-gate as well as multi-gate devices with planar and vertical architectures. Surface properties, coverage, bonding saturation and passivation, and annealing ambient are also discussed.
More details
Series
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Dimensions
Height: 235 mm
Width: 157 mm
Thickness: 23 mm
Weight
638 gr
ISBN-13
978-1-60511-040-0 (9781605110400)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions

B. J. Pawlak | M. L. Pelaz | M. Law
Doping Engineering for Front-End Processing: Volume 1070
Volume 1070
Book
06/2014
Cambridge University Press
€40.00
Shipment within 15-20 days
Persons
Editor
Universidad de Valladolid, Spain
University of Florida
Content
Preface; Part I. Ultra Shallow Junctions I; Part II. Shallow Junction Contacting; Part III. Poster Session; Part IV. Ultra Shallow Junctions II; Part V. Solid Phase Epitaxial Regrowth; Part VI. Modeling and Simulation; Author index; Subject index.