
Doping Engineering for Front-End Processing: Volume 1070
Volume 1070
Cambridge University Press
Published on 5. June 2014
Book
Paperback/Softback
336 pages
978-1-107-40854-8 (ISBN)
Description
Materials scientists, silicon technologists and TCAD researchers come together in this book to share experimental results and physical models, discuss achievements and challenges, and identify key issues for future research in this field. The volume focuses on many aspects related to doping of semiconductors (Si, SiGe and Ge) for device fabrication, and explores areas for single-gate as well as multi-gate devices with planar and vertical architectures. Surface properties, coverage, bonding saturation and passivation, and annealing ambient are also discussed.
More details
Series
Language
English
Place of publication
Cambridge
United Kingdom
Target group
College/higher education
Professional and scholarly
Product notice
Paperback (trade)
Dimensions
Height: 229 mm
Width: 152 mm
Thickness: 18 mm
Weight
488 gr
ISBN-13
978-1-107-40854-8 (9781107408548)
Copyright in bibliographic data and cover images is held by Nielsen Book Services Limited or by the publishers or by their respective licensors: all rights reserved.
Schweitzer Classification
Other editions
Additional editions

B. J. Pawlak | M. L. Pelaz | M. Law
Doping Engineering for Front-End Processing: Volume 1070
Book
10/2008
Materials Research Society
€101.30
Shipment within 3-4 weeks
Persons
Editor
Universidad de Valladolid, Spain
University of Florida
Content
Preface; Part I. Ultra Shallow Junctions I; Part II. Shallow Junction Contacting; Part III. Poster Session; Part IV. Ultra Shallow Junctions II; Part V. Solid Phase Epitaxial Regrowth; Part VI. Modeling and Simulation; Author index; Subject index.