Packaging of High Power Semiconductor Lasers
1st Edition
Published on 1. October 2016
Book
Paperback/Softback
XV, 402 pages
978-1-4939-5590-9 (ISBN)
Description
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
More details
Product info
Previously published in hardcover
Series
Edition
Softcover reprint of the original 1st ed. 2015
Language
English
Place of publication
NY
United States
Target group
Professional and scholarly
Illustrations
386
27 s/w Tabellen, 111 s/w Abbildungen, 386 farbige Abbildungen
XV, 402 p. 497 illus., 386 illus. in color.
Dimensions
Height: 235 mm
Width: 155 mm
Thickness: 22 mm
Weight
710 gr
ISBN-13
978-1-4939-5590-9 (9781493955909)
DOI
10.1007/978-1-4614-9263-4
Schweitzer Classification
Other editions
Additional editions
Xingsheng Liu | Wei Zhao | Lingling Xiong
Packaging of High Power Semiconductor Lasers
Book
07/2014
Springer
€181.89
Shipment within 15-20 days
Persons
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
Content
Introduction of High Power Semiconductor Lasers.- Package Types of High Power Semiconductor Lasers.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress Failures: Prediction and Prevention.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Processes in Packaging of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Reliability Assessment and Failure Analysis in High Power Semiconductor Lasers.- Technology Trend and Challenges in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.