
Packaging of High Power Semiconductor Lasers
Springer (Publisher)
Published on 15. July 2014
Book
Hardback
XV, 402 pages
978-1-4614-9262-7 (ISBN)
Description
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
More details
Series
Edition
2015
Language
English
Place of publication
New York
United States
Target group
Professional and scholarly
Research
Illustrations
111 s/w Abbildungen, 386 farbige Abbildungen
XV, 402 p. 497 illus., 386 illus. in color.
Dimensions
Height: 241 mm
Width: 160 mm
Thickness: 29 mm
Weight
793 gr
ISBN-13
978-1-4614-9262-7 (9781461492627)
DOI
10.1007/978-1-4614-9263-4
Schweitzer Classification
Other editions
Additional editions

Xingsheng Liu | Wei Zhao | Lingling Xiong
Packaging of High Power Semiconductor Lasers
Book
10/2016
1st Edition
Springer
€181.89
Shipment within 15-20 days

Xingsheng Liu | Wei Zhao | Lingling Xiong
Packaging of High Power Semiconductor Lasers
E-Book
07/2014
Springer
€171.19
Available for download
Persons
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi'an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
Content
Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.